Assignee
AT & S CHINA CO LTD
CN·36 granted patents·6 pending applications·17 citations·filing 2015–2023
Top patents by PatentIndex Score
42 records- 0194US11452212B2Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partiallyAT & S CHINA CO LTD·Filed 2020·Granted Sep 20, 2022·7 cites·10 claims
- 0283US11470714B2Component carrier with embedded component and horizontally elongated viaAT & S CHINA CO LTD·Filed 2020·Granted Oct 11, 2022·2 cites·19 claims
- 0383US10643928B2Electronic device with a plurality of component carrier packages being electrically and mechanically connectedAT & S CHINA CO LTD·Filed 2016·Granted May 5, 2020·4 cites·19 claims
- 0482US11343916B2Component carrier and method of manufacturing the sameAT & S CHINA CO LTD·Filed 2020·Granted May 24, 2022·1 cites·19 claims
- 0578US11291119B2Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulusAT & S CHINA CO LTD·Filed 2020·Granted Mar 29, 2022·1 cites·25 claims
- 0673US10653009B1Component carrier with improved toughness factorAT & S CHINA CO LTD·Filed 2019·Granted May 12, 2020·1 cites·19 claims
- 0772US11700690B2Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design ruleAT & S CHINA CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 0869US12048101B2Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laserAT & S CHINA CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 0967US11672079B2Component carrier with improved bending performanceAT & S CHINA CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·16 claims
- 1067US10939548B2Component carrier with improved toughness factorAT & S CHINA CO LTD·Filed 2020·Granted Mar 2, 2021·0 cites·20 claims
- 1166US11051391B2Thermally highly conductive coating on base structure accommodating a componentAT & S CHINA CO LTD·Filed 2018·Granted Jun 29, 2021·1 cites·19 claims
- 1263US12127338B2Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulusAT & S CHINA CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·19 claims
- 1363US11219129B2Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design ruleAT & S CHINA CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·17 claims
- 1458US2020154558A1Component Carrier With Improved Bending PerformanceAT & S CHINA CO LTD·Filed 2019·Application pending·0 cites
- 1555US11688668B2Component carrier with low shrinkage dielectric materialAT & S CHINA CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·20 claims
- 1654US11963310B2Component carrier having component covered with ultra-thin transition layerAT & S CHINA CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
- 1753US11589462B2Semi-flexible component carrier with stepped layer structureAT & S CHINA CO LTD·Filed 2019·Granted Feb 21, 2023·0 cites·19 claims
- 1853US2023180383A1Component CarrierAT & S CHINA CO LTD·Filed 2023·Application pending·0 cites
- 1953US2023038270A1Protection Structure for an Aperture for an Optical Component Embedded Within a Component CarrierAT & S CHINA CO LTD·Filed 2022·Application pending·0 cites
- 2053US2023043085A1Component Carrier With Different Stack Heights and Vertical Opening and Manufacturing MethodsAT & S CHINA CO LTD·Filed 2022·Application pending·0 cites
- 2152US11670613B2Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing methodAT & S CHINA CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·19 claims
- 2252US11330706B2Component carrier with embedded large dieAT & S CHINA CO LTD·Filed 2019·Granted May 10, 2022·0 cites·18 claims
- 2352US11127670B2Component carrier with stabilizing structure for interface adhesionAT & S CHINA CO LTD·Filed 2020·Granted Sep 21, 2021·0 cites·15 claims
- 2452US10701793B2Component carrier comprising a copper filled multiple-diameter laser drilled boreAT & S CHINA CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·16 claims
- 2551US11219120B2Stress relief opening for reducing warpage of component carriersAT & S CHINA CO LTD·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 2650US12490376B2Component carrier with asymmetric build-up and methods for determining a design of and manufacturing the sameAT & S CHINA CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 2749US2023171897A1Method of Manufacturing a Component Carrier and a Component CarrierAT & S CHINA CO LTD·Filed 2022·Application pending·0 cites
- 2847US10834831B2Component carrier with alternatingly vertically stacked layer structures of different electric densityAT & S CHINA CO LTD·Filed 2016·Granted Nov 10, 2020·0 cites·20 claims
- 2946US10278280B2Component carrier comprising a copper filled multiple-diameter laser drilled boreAT & S CHINA CO LTD·Filed 2017·Granted Apr 30, 2019·0 cites·17 claims
- 3044US11937369B2Traceability of subsequent layer structure manufacturing of main body for component carriers by means of laterally and vertically displaced information carrying structuresAT & S CHINA CO LTD·Filed 2019·Granted Mar 19, 2024·0 cites·28 claims
- 3143US11116075B2Component carrier comprising dielectric structures with different physical propertiesAT & S CHINA CO LTD·Filed 2020·Granted Sep 7, 2021·0 cites·17 claims
- 3243US11039535B2Manufacturing holes in component carrier materialAT & S CHINA CO LTD·Filed 2020·Granted Jun 15, 2021·0 cites·21 claims
- 3343US10595414B2Component carrier and manufacturing methodAT & S CHINA CO LTD·Filed 2018·Granted Mar 17, 2020·0 cites·16 claims
- 3442US10433415B2Component carrier comprising a copper filled mechanical drilled multiple-diameter boreAT & S CHINA CO LTD·Filed 2017·Granted Oct 1, 2019·0 cites·12 claims
- 3538US10779415B2Component embedding in thinner core using dielectric sheetAT & S CHINA CO LTD·Filed 2017·Granted Sep 15, 2020·0 cites·18 claims
- 3637US10973133B2Sacrificial structure with dummy core and two sections of separate material thereon for manufacturing component carriersAT & S CHINA CO LTD·Filed 2016·Granted Apr 6, 2021·0 cites·20 claims
- 3736US11116083B2Electronic component embedded by laminate sheetAT & S CHINA CO LTD·Filed 2017·Granted Sep 7, 2021·0 cites·18 claims
- 3835US10806027B2Component carrier with different surface finishesAT & S CHINA CO LTD·Filed 2017·Granted Oct 13, 2020·0 cites·16 claims
- 3933US11051410B2Component carriers sandwiching a sacrificial structure and having pure dielectric layers next to the sacrificial structureAT & S CHINA CO LTD·Filed 2016·Granted Jun 29, 2021·0 cites·19 claims
- 4030US2020305279A1Semi-finished product for the production of connection systems for electronic componentsAT & S CHINA CO LTD·Filed 2020·Application pending·0 cites
- 4129US11166385B2Component carrier having a laser via and method of manufacturingAT & S CHINA CO LTD·Filed 2019·Granted Nov 2, 2021·0 cites·17 claims
- 4223US10729013B2Semi-finished product for the production of connection systems for electronic components and methodAT & S CHINA CO LTD·Filed 2015·Granted Jul 28, 2020·0 cites·12 claims
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