Component Carrier With Improved Bending Performance

Abstract

A component carrier, wherein the component carrier includes: i) a layer stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, ii) a bendable portion which forms at least a part of the layer stack, and iii) a metal layer which forms at least a part of the bendable portion. Hereby, the metal layer extends over at least 75% of the area of the bendable portion.

1 . A component carrier, wherein the component carrier comprises:
 a layer stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;   a bendable portion which forms at least a part of the layer stack; and   a metal layer which forms at least a part of the bendable portion;   
       wherein the metal layer extends over at least 75% of the area of the bendable portion. 
     
     
         2 . The component carrier according to  claim 1 ,
 wherein the metal layer is a continuous layer that extends over the whole area of the bendable portion.   
     
     
         3 . The component carrier according to  claim 1 ,
 wherein the metal layer is a patterned layer.   
     
     
         4 . The component carrier according to  claim 1 ,
 wherein the metal layer is a metal foil, in particular a copper foil.   
     
     
         5 . The component carrier according to  claim 1 ,
 wherein the metal layer is an outermost layer of the layer stack.   
     
     
         6 . The component carrier according to  claim 1 ,
 wherein the metal layer is in direct contact with a solder mask, and   wherein the solder mask is an outermost layer of the layer stack.   
     
     
         7 . The component carrier according to  claim 1 ,
 wherein the metal layer is configured as an antenna structure.   
     
     
         8 . The component carrier according to  claim 1 ,
 wherein the metal layer is configured for carrying an electric signal, in particular during operation of the component carrier.   
     
     
         9 . The component carrier according to  claim 1 ,
 wherein the metal layer has a tensile strength of at least 170 MPa.   
     
     
         10 . The component carrier according to  claim 1 ,
 wherein the component carrier is configured as a purely flexible component carrier or as a semi-flexible component carrier.   
     
     
         11 . The component carrier according to  claim 1 ,
 wherein the layer stack comprises a recessed portion, and   wherein the bendable portion is formed at the recessed portion.   
     
     
         12 . The component carrier according to  claim 11 ,
 wherein at least one non-recessed portion of the layer stack is formed as a rigid portion which is not bendable.   
     
     
         13 . The component carrier according to  claim 12 ,
 wherein the bendable portion is formed between a first rigid portion and a second rigid portion.   
     
     
         14 . The component carrier according to  claim 13 ,
 wherein the bottom of the bendable portion is flush with the bottom of the first rigid portion and the bottom of the second rigid portion.   
     
     
         15 . The component carrier according to  claim 13 ,
 wherein the metal layer is formed at the bottom of the bendable portion, and   wherein the metal layer is not flush with the bottom the first rigid portion and the bottom of the second rigid portion.   
     
     
         16 . The component carrier according to  claim 11 ,
 wherein the recessed portion is formed in a viewing direction being parallel to the main directions of extension of the component carrier, and/or   wherein the recessed portion is formed in a viewing direction being perpendicular to the main directions of extension of the component carrier.   
     
     
         17 . The component carrier according to  claim 13 ,
 wherein at least one layer of the layer stack extends from the first rigid portion through the bendable portion to the second rigid portion.   
     
     
         18 . The component carrier according to  claim 13 ,
 wherein the rigid portions are connected to the bendable portion via a rigid connection.   
     
     
         19 . The component carrier according to  claim 1 ,
 wherein the bending portion comprises a further metal layer, and at least one electrically insulating layer structure arranged between the metal layer and the further metal layer.   
     
     
         20 . A method for manufacturing a component carrier, the method comprising:
 forming a layer stack comprising at least one electrically conductive layer structure and/or at least one electrically insulating layer structure;   forming a bendable portion which forms at least a part of the layer stack; and   forming a metal layer as at least a part of the bendable portion such that the metal layer extends over at least 75% of the area of the bendable portion.