Inventor · disambiguated record
Mikael Tuominen
Also filed as: TUOMINEN MIKAEL · TUOMINEN MIKAEL ANDREAS
43 granted patents·7 pending applications·50 citations·filing 2013–2023
96Inventor score
Files withAT & S CHINA CO LTD29AT & S AUSTRIA TECH & SYSTEMTECHNIK AG18AUSTRIA TECH & SYSTEM TECH2AT&S CHONGQING COMPANY LTD1
Top patents by PatentIndex Score
50 records- 0194US11452212B2Component carrier with electrically conductive layer structures having windows defined by a conformal mask and tapering at least partiallyAT & S CHINA CO LTD·Filed 2020·Granted Sep 20, 2022·7 cites·10 claims
- 0289US9781845B2Semi-finished product for the production of a printed circuit board and method for producing the sameAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Oct 3, 2017·9 cites·7 claims
- 0385US11546990B2Component carrier with bridge structure in through hole fulfilling minimum distance design ruleAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jan 3, 2023·2 cites·19 claims
- 0483US11470714B2Component carrier with embedded component and horizontally elongated viaAT & S CHINA CO LTD·Filed 2020·Granted Oct 11, 2022·2 cites·19 claims
- 0583US10643928B2Electronic device with a plurality of component carrier packages being electrically and mechanically connectedAT & S CHINA CO LTD·Filed 2016·Granted May 5, 2020·4 cites·19 claims
- 0682US11343916B2Component carrier and method of manufacturing the sameAT & S CHINA CO LTD·Filed 2020·Granted May 24, 2022·1 cites·19 claims
- 0779US11211317B2Component carrier comprising a component having vertical through connectionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 28, 2021·1 cites·11 claims
- 0878US11291119B2Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulusAT & S CHINA CO LTD·Filed 2020·Granted Mar 29, 2022·1 cites·25 claims
- 0977US9648758B2Method for producing a circuit board and use of such a methodAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted May 9, 2017·7 cites·16 claims
- 1076US9521743B2Printed circuit board with crosstalk reduction featuresAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted Dec 13, 2016·4 cites·9 claims
- 1175US10651215B2Sensor systemAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted May 12, 2020·1 cites·17 claims
- 1274US11605569B2Packaged integrated circuit with interposing functionality and method for manufacturing such a packaged integrated circuitAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Mar 14, 2023·2 cites·4 claims
- 1373US10653009B1Component carrier with improved toughness factorAT & S CHINA CO LTD·Filed 2019·Granted May 12, 2020·1 cites·19 claims
- 1473US9820381B2Semi-finished product for the production of a printed circuit board and method for producing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted Nov 14, 2017·6 cites·7 claims
- 1572US11700690B2Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design ruleAT & S CHINA CO LTD·Filed 2021·Granted Jul 11, 2023·0 cites·15 claims
- 1669US12048101B2Component carrier with well-defined outline sidewall cut by short laser pulse and/or green laserAT & S CHINA CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 1769US2024030095A1Electronic Package Comprising a Decoupling Layer StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1867US11672079B2Component carrier with improved bending performanceAT & S CHINA CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·16 claims
- 1967US10939548B2Component carrier with improved toughness factorAT & S CHINA CO LTD·Filed 2020·Granted Mar 2, 2021·0 cites·20 claims
- 2066US11051391B2Thermally highly conductive coating on base structure accommodating a componentAT & S CHINA CO LTD·Filed 2018·Granted Jun 29, 2021·1 cites·19 claims
- 2165US12058810B2Semi-flex component carrier with dielectric material having high elongation and low young modulusAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Aug 6, 2024·0 cites·25 claims
- 2263US12127338B2Semi-flex component carrier with dielectric material surrounding an embedded component and having locally reduced young modulusAT & S CHINA CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·19 claims
- 2363US11219129B2Component carrier with blind hole filled with an electrically conductive medium and fulfilling a minimum thickness design ruleAT & S CHINA CO LTD·Filed 2020·Granted Jan 4, 2022·0 cites·17 claims
- 2461US11284508B2Semi-flex component carrier with dielectric material having high elongation and low young modulusAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Mar 22, 2022·0 cites·29 claims
- 2561US9801270B2Printed circuit board having a ground plane with angled openings oriented between 30 to 60 degreesAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted Oct 24, 2017·1 cites·5 claims
- 2658US11083081B2Electronic package comprising a decoupling layer structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Aug 3, 2021·0 cites·20 claims
- 2758US2020154558A1Component Carrier With Improved Bending PerformanceAT & S CHINA CO LTD·Filed 2019·Application pending·0 cites
- 2857US11617259B2Component carrier with embedded component exposed by blind holeAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Mar 28, 2023·0 cites·18 claims
- 2956US12041730B2Component carrier with low-solvent fiber-free dielectric layerAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Jul 16, 2024·0 cites·14 claims
- 3055US11688668B2Component carrier with low shrinkage dielectric materialAT & S CHINA CO LTD·Filed 2020·Granted Jun 27, 2023·0 cites·20 claims
- 3155US2025293103A1Cavity Formation Using Depth Routing, Component Carrier and Component Carrier AssemblyAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 3254US11963310B2Component carrier having component covered with ultra-thin transition layerAT & S CHINA CO LTD·Filed 2020·Granted Apr 16, 2024·0 cites·20 claims
- 3354US11445601B2Component carrier and method of manufacturing a component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 3453US11589462B2Semi-flexible component carrier with stepped layer structureAT & S CHINA CO LTD·Filed 2019·Granted Feb 21, 2023·0 cites·19 claims
- 3553US11160165B2Component carrier with through hole extending through multiple dielectric layersAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Oct 26, 2021·0 cites·14 claims
- 3653US2023180383A1Component CarrierAT & S CHINA CO LTD·Filed 2023·Application pending·0 cites
- 3753US2023038270A1Protection Structure for an Aperture for an Optical Component Embedded Within a Component CarrierAT & S CHINA CO LTD·Filed 2022·Application pending·0 cites
- 3853US2023043085A1Component Carrier With Different Stack Heights and Vertical Opening and Manufacturing MethodsAT & S CHINA CO LTD·Filed 2022·Application pending·0 cites
- 3952US11670613B2Arrangement with central carrier and two opposing layer stacks, component carrier and manufacturing methodAT & S CHINA CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·19 claims
- 4052US11330706B2Component carrier with embedded large dieAT & S CHINA CO LTD·Filed 2019·Granted May 10, 2022·0 cites·18 claims
- 4151US11219120B2Stress relief opening for reducing warpage of component carriersAT & S CHINA CO LTD·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 4250US12490376B2Component carrier with asymmetric build-up and methods for determining a design of and manufacturing the sameAT & S CHINA CO LTD·Filed 2023·Granted Dec 2, 2025·0 cites·20 claims
- 4347US10834831B2Component carrier with alternatingly vertically stacked layer structures of different electric densityAT & S CHINA CO LTD·Filed 2016·Granted Nov 10, 2020·0 cites·20 claims
- 4444US10643953B2Electronic component packaged in component carrier serving as shielding cageAUSTRIA TECH & SYSTEM TECH·Filed 2016·Granted May 5, 2020·0 cites·4 claims
- 4543US10595414B2Component carrier and manufacturing methodAT & S CHINA CO LTD·Filed 2018·Granted Mar 17, 2020·0 cites·16 claims
- 4643US2020163223A1Method of Manufacturing a Component Carrier Using a Separation Component, the Component Carrier, and a Semifinished ProductAT&S CHONGQING COMPANY LTD·Filed 2019·Application pending·0 cites
- 4741US11410965B2Electronic device with embedded component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Aug 9, 2022·0 cites·12 claims
- 4838US10779415B2Component embedding in thinner core using dielectric sheetAT & S CHINA CO LTD·Filed 2017·Granted Sep 15, 2020·0 cites·18 claims
- 4936US11116083B2Electronic component embedded by laminate sheetAT & S CHINA CO LTD·Filed 2017·Granted Sep 7, 2021·0 cites·18 claims
- 5035US10806027B2Component carrier with different surface finishesAT & S CHINA CO LTD·Filed 2017·Granted Oct 13, 2020·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →