Electronic Package Comprising a Decoupling Layer Structure

Abstract

An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.

1 . An electronic package, comprising:
 a base structure;   a layer stack formed over the base structure; and   
       a component embedded at least partially within the base structure and/or within the layer stack;
 wherein the layer stack comprises a decoupling layer structure, the decoupling layer structure comprising a decoupling material having a Young Modulus being smaller than 1 GPa; 
 wherein the decoupling material mechanically decouples at least partially one portion of the electronic package formed at one side of the decoupling layer structure from another portion of the electronic package formed at the other side of the decoupling layer structure; 
 wherein the decoupling material has a Coefficient of Thermal Expansion CTE, 
 wherein at a temperature smaller than the glass transition temperature the CTE is in the range of between 30 ppm and 200 ppm and/or wherein at a temperature larger than the glass transition temperature the CTE is in the range between 25 ppm to 800 ppm; 
 wherein the component is embedded into the decoupling material such that the decoupling material is in direct contact with the component at at least three sides of the component. 
 
     
     
         2 . The electronic package as set forth in  claim 1 , wherein the decoupling material comprises a blend of at least one resin and at least one softening component. 
     
     
         3 . The electronic package as set forth in  claim 1 , wherein the decoupling material comprises copolymer, wherein at least one softening component is copolymerized into a polymer chain of the copolymer. 
     
     
         4 . The electronic package as set forth  claim 1 , wherein the decoupling material has a Young Modulus smaller than 0.5 GPa. 
     
     
         5 . The electronic package as set forth in  claim 1 , wherein the decoupling material has a Coefficient of Thermal Expansion, CTE, wherein at a temperature smaller than the glass transition temperature the CTE is in the range between 30 ppm to 120 ppm. 
     
     
         6 . The electronic package as set forth in  claim 1 , wherein the decoupling material has a Coefficient of Thermal Expansion, CTE, wherein at a temperature larger than the glass transition temperature the CTE is in the range between 50 ppm to 400 ppm. 
     
     
         7 . The electronic package as set forth in  claim 1 , wherein the base structure comprises a base material which exhibits a Young modulus being smaller than 5 GPa. 
     
     
         8 . The electronic package as set forth in  claim 1 , wherein at room temperature the decoupling material comprises a reversible deformability being in the range between 1% and 10%. 
     
     
         9 . The electronic package as set forth in  claim 1 , wherein at 200° C. the decoupling material comprises a reversible deformability being in the range between 1% and 10%. 
     
     
         10 . The electronic package as set forth in  claim 1 , wherein at room temperature the decoupling material comprises an irreversible deformability being in the range between 0.35% and 8%. 
     
     
         11 . The electronic package as set forth in  claim 1 , wherein at 200° C. the decoupling material comprises an irreversible deformability being in the range between 3.7% and 15%. 
     
     
         12 . The electronic package as set forth in  claim 1 , wherein at 200° C. the decoupling material comprises a creeping deformability over 180 minutes being in the range between 0.5% and 6%. 
     
     
         13 . The electronic package as set forth in  claim 1 , wherein the decoupling layer structure is formed directly at at least one side of the component. 
     
     
         14 . The electronic package as set forth in  claim 13 , the electronic package further comprising:
 an electric connection structure which is electrically connected with terminals of the component and which (i) electrically connects the component with other components of the electronic package and/or which (ii) is configured for electrically connecting the component with circuitry being external to the electronic package,   
       wherein the electric connection structure is formed at least partially within the decoupling layer structure. 
     
     
         15 . The electronic package as set forth in  claim 1 , wherein a creeping deformability over 180 minutes being in the range between 0.5% and 6%. 
     
     
         16 . The electronic package as set forth in  claim 1 , wherein the decoupling material is a material being free from a mesh. 
     
     
         17 . The electronic package as set forth in  claim 1 , wherein within an XY-plane being parallel to the main planes of the layer stack the embedded component has a length and/or a width of larger than 2 mm. 
     
     
         18 . The electronic package as set forth in  claim 17 , wherein within an XY-plane being parallel to the main planes of the layer stack the area ratio between the area of the component and the area of the entire package is larger than 10%. 
     
     
         19 . The electronic package as set forth in  claim 1 , wherein the electronic package comprises at least one of the following features:
 the layer stack comprises at least one electrically insulating layer structure made from a PCB material, and   the layer stack comprises at least one electrically conductive layer structure made from a PCB material.   
     
     
         20 . A method for manufacturing an electronic package, the method comprising:
 providing a base structure;   forming a layer stack over the base structure, wherein the layer stack comprises a decoupling layer structure, the decoupling layer structure comprising a decoupling material having a Young Modulus being smaller than 1 GPa; and   embedding a component at least partially within the base structure and/or within the layer stack;   wherein the decoupling material mechanically decouples at least partially one portion of the electronic package formed at one side of the decoupling layer structure from another portion of the electronic package formed at the other side of the decoupling layer structure;   wherein the decoupling material has a Coefficient of Thermal Expansion CTE,   wherein at a temperature smaller than the glass transition temperature the CTE is in the range of between 30 ppm and 200 ppm and/or wherein at a temperature larger than the glass transition temperature the CTE is in the range between 25 ppm to 800 ppm;   wherein the component is embedded into the decoupling material such that the decoupling material is in direct contact with the component at at least three sides of the component.