Inventor · disambiguated record
Gerald Weidinger
Also filed as: WEIDINGER GERALD
26 granted patents·8 pending applications·39 citations·filing 2008–2023
93Inventor score
Files withAT & S AUSTRIA TECH & SYSTEMTECHNIK AG20AUSTRIA TECH & SYSTEM TECH9WEIDINGER GERALD3STAHR JOHANNES1WEICHSLBERGER GUENTHER1
Top patents by PatentIndex Score
34 records- 0193US12112888B2Component carrier with cavity accommodating at least part of driven body being magnetically drivable to moveAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Oct 8, 2024·2 cites·13 claims
- 0291US10665526B2Component carrier comprising at least one heat pipe and method for producing said component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted May 26, 2020·8 cites·12 claims
- 0385US9253888B2Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate productWEIDINGER GERALD·Filed 2012·Granted Feb 2, 2016·9 cites·18 claims
- 0484US10187997B2Method for making contact with a component embedded in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Jan 22, 2019·5 cites·7 claims
- 0578US12400968B2Component with dielectric layer for embedding in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Granted Aug 26, 2025·0 cites·16 claims
- 0675US12185478B2Printed circuit board having embedded componentAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Dec 31, 2024·0 cites·19 claims
- 0775US10993313B2Non-uniform magnetic foil embedded in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Apr 27, 2021·2 cites·17 claims
- 0875US8685196B2Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodWEICHSLBERGER GUENTHER·Filed 2010·Granted Apr 1, 2014·5 cites·37 claims
- 0974US12002614B2Inductor made of component carrier material comprising electrically conductive plate structuresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jun 4, 2024·0 cites·17 claims
- 1073US11523520B2Method for making contact with a component embedded in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Dec 6, 2022·1 cites·25 claims
- 1172US11749613B2Component with dielectric layer for embedding in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Sep 5, 2023·0 cites·13 claims
- 1271US12482595B2Component carrier with embedded magnetic inlay and integrated coil structureAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Granted Nov 25, 2025·0 cites·19 claims
- 1371US8388792B2Nonstick material, method for removing a part of a planar material layer and multilayer structure and use thereforWEIDINGER GERALD·Filed 2008·Granted Mar 5, 2013·4 cites·5 claims
- 1469US2024030095A1Electronic Package Comprising a Decoupling Layer StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 1565US10861636B2Inductor made of component carrier material comprising electrically conductive plate structuresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Dec 8, 2020·0 cites·15 claims
- 1664US11749573B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2021·Granted Sep 5, 2023·0 cites·9 claims
- 1761US11171092B2Component with dielectric layer for embedding in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Nov 9, 2021·0 cites·8 claims
- 1861US10867888B2Component carrier comprising at least one heat pipe and method for producing said component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 1961US8541689B2Method for removing a part of a planar material layer and multilayer structureWEIDINGER GERALD·Filed 2008·Granted Sep 24, 2013·2 cites·21 claims
- 2060US10051747B2Method for the production of a circuit board involving the removal of a subregion thereofAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2012·Granted Aug 14, 2018·1 cites·19 claims
- 2157US11049778B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2019·Granted Jun 29, 2021·0 cites·8 claims
- 2256US2013149506A1Nonstick material, method for removing a part of a planar material layer and multilayer structure and use thereforAUSTRIA TECH & SYSTEM TECH·Filed 2013·Application pending·0 cites
- 2354US11792932B2Component carrier with embedded magnetic inlay and integrated coil structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Oct 17, 2023·0 cites·20 claims
- 2451US2022377917A1Component Carrier With Magnetic Element, Magnetic Inlay, and Manufacturing MethodSTAHR JOHANNES·Filed 2022·Application pending·0 cites
- 2551US2014216795A1Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 2650US2018257364A1Use of nonstick material for the production of cavities in a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2018·Application pending·0 cites
- 2749US2023298808A1Inductor Inlay for a Component Carrier and a Method of Manufacturing the SameAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 2847US11889629B2Component carrier comprising embedded magnet stackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jan 30, 2024·0 cites·14 claims
- 2944US2021241952A1Substantially Annular Magnetic Member With Magnetic Particles in Non-Magnetic Matrix For Component CarrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Application pending·0 cites
- 3043US2014373350A1Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a MethodAUSTRIA TECH & SYSTEM TECH·Filed 2012·Application pending·0 cites
- 3141US10709023B2Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrateAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jul 7, 2020·0 cites·18 claims
- 3241US10455703B2Method for producing a printed circuit board with an embedded sensor chip, and printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Oct 22, 2019·0 cites·9 claims
- 3335US10306750B2Circuit board and method for manufacturing a circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted May 28, 2019·0 cites·17 claims
- 3433US9967972B2Circuit board having an asymmetric layer structureAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted May 8, 2018·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →