Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method

Abstract

In a method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region ( 11 ) thereof is removed, and wherein in order to prevent adherence of the partial region ( 11 ) to be removed a material ( 8 ) preventing adhesion is applied in accordance with the partial region to be removed onto a layer ( 9 ) which adjoins the partial region to be removed, it is provided that the material ( 8 ) preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, whereby a partial region to be removed can be removed easily and reliably after appropriate treatment and/or processing steps of the multilayer printed circuit board. In addition, an adhesion prevention material and a use of the method in connection with the production of a multilayer printed circuit board ( 1 ) are provided.

1 - 34 . (canceled) 
     
     
         35 . A method for producing a multilayer printed circuit board from a plurality of conducting or conductive and non-conducting or insulating layers or plies to be connected to each other, in particular to be pressed together, wherein after connecting at least partially planar layers at least a partial region thereof is removed, and wherein in order to prevent adherence of the partial region to be removed a material preventing adhesion is applied in accordance with the partial region to be removed onto a layer which adjoins the partial region to be removed, wherein the material preventing adhesion is formed by a mixture comprising a release agent on the basis of at least one metal soap, preferably the fatty acid salts of Al, Mg, Ca, Na and Zn, a binding agent, and a solvent, wherein the release agent is used in an amount of less than 60% by weight, in particular about 5% by weight to 45% by weight, of the adhesion-preventing material. 
     
     
         36 . A multilayer printed circuit board produced by a method according to  claim 35 . 
     
     
         37 . The use of a method according to  claim 35  for producing of a multilayer printed circuit board. 
     
     
         38 . The use according to  claim 37  for producing hollow spaces, in particular three-dimensional hollow spaces, or cavities in a printed circuit board. 
     
     
         39 . The use according to  claim 37  for producing at least one channel in a printed circuit board. 
     
     
         40 . The use according to  claim 38  for embedding electronic and/or mechanical components. 
     
     
         41 . The use according to  claim 38  for transmitting sound, light, liquids and/or gases. 
     
     
         42 . The use according to  claim 38  for receiving electronic components and structural components such as, for instance, memory cards, electronic interfaces or connectors or antennas in said hollow spaces or cavities. 
     
     
         43 . The use according to  claim 38 , wherein the hollow spaces, cavities or channels are subsequently filled, covered or lined with conducting, insulating, inhibiting, reabsorbing, reflecting or sealing layers by chemical, physical or galvanic deposition procedures. 
     
     
         44 . The use according to  claim 37  for exposing at least one element, particularly registering element, in the interior or in internal layers of a multilayer printed circuit board. 
     
     
         45 . The use according to  claim 37  for producing offset and/or stepped partial regions of a printed circuit board. 
     
     
         46 . The use according to  claim 37  for producing a rigid flexible circuit board. 
     
     
         47 . The method according to  claim 35 , wherein a cellulose derivative, in particular cellulose ether or ester, preferably ethyl cellulose, is used as a binding agent. 
     
     
         48 . A multilayer printed circuit board produced by using an adhesion prevention material according to  claim 47 . 
     
     
         49 . The use of an adhesion prevention material according to  claim 48  for producing of a multilayer printed circuit board.