Inventor · disambiguated record
Markus Leitgeb
Also filed as: LEITGEB MARKUS
40 granted patents·21 pending applications·45 citations·filing 2008–2024
96Inventor score
Files withAT & S AUSTRIA TECH & SYSTEMTECHNIK AG32AUSTRIA TECH & SYSTEM TECH16AT&S AUSTRIA TECH & SYSTEMTECHNIK AKTIENGESCHAFT2STAHR JOHANNES2UMICORE NV2
Top patents by PatentIndex Score
61 records- 0189US11450587B2Heat removal mechanism for stack-based electronic device with process control component and processing componentsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Sep 20, 2022·2 cites·15 claims
- 0283US9763337B2Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit boardAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2013·Granted Sep 12, 2017·6 cites·3 claims
- 0379US10420206B2Component carrier comprising a deformation counteracting structureAUSTRIA TECH & SYSTEM TECH·Filed 2016·Granted Sep 17, 2019·3 cites·18 claims
- 0478US10887977B2Hybrid component carrier and method for manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jan 5, 2021·2 cites·9 claims
- 0576US11452199B2Electronic module with single or multiple components partially surrounded by a thermal decoupling gapAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Sep 20, 2022·2 cites·20 claims
- 0676US11069622B2Interposer-type component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jul 20, 2021·2 cites·24 claims
- 0775US10308768B2Poly- or prepolymer composition, or embossing lacquer comprising such a composition and use thereofJOANNEUM RES FORSCHUNGSGMBH·Filed 2015·Granted Jun 4, 2019·3 cites·17 claims
- 0875US8685196B2Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodWEICHSLBERGER GUENTHER·Filed 2010·Granted Apr 1, 2014·5 cites·37 claims
- 0975US8500938B2Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit boardSTAHR JOHANNES·Filed 2008·Granted Aug 6, 2013·7 cites·15 claims
- 1071US8388792B2Nonstick material, method for removing a part of a planar material layer and multilayer structure and use thereforWEIDINGER GERALD·Filed 2008·Granted Mar 5, 2013·4 cites·5 claims
- 1170US11037881B2Component carrier with face-up and face-down embedded componentsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jun 15, 2021·1 cites·16 claims
- 1269US10383208B2Hybrid component carrier and method for manufacturing the sameAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Aug 13, 2019·1 cites·19 claims
- 1367US11201119B2RF functionality and electromagnetic radiation shielding in a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Dec 14, 2021·1 cites·19 claims
- 1466US12463124B2Component carrier with surface mounted components connected by high density connection regionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Nov 4, 2025·0 cites·19 claims
- 1566US11058007B2Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portionsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jul 6, 2021·1 cites·13 claims
- 1665US10356904B2Conductor track with enlargement-free transition between conductor path and contact structureAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jul 16, 2019·1 cites·18 claims
- 1764US11784132B2Interposer-type component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Oct 10, 2023·0 cites·10 claims
- 1863US2024429175A1Component Carrier with Stack-Stack Connection for Connecting ComponentsAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 1962US11682600B2Protection layer for panel handling systemsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jun 20, 2023·1 cites·21 claims
- 2062US2024422907A1Component Carrier With Continuously Extending Vertical Connection Structure, and Manufacturing MethodAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 2161US8541689B2Method for removing a part of a planar material layer and multilayer structureWEIDINGER GERALD·Filed 2008·Granted Sep 24, 2013·2 cites·21 claims
- 2260US10051747B2Method for the production of a circuit board involving the removal of a subregion thereofAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2012·Granted Aug 14, 2018·1 cites·19 claims
- 2359US2019306983A1Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Application pending·0 cites
- 2457US2025070005A1Ic substrate having central section with vertically stacked functional volume sectionsAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 2556US11388824B2Component carrier having a three dimensionally printed wiring structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jul 12, 2022·0 cites·16 claims
- 2656US2025038117A1Ic substrate with support structure and functional inlays thereinAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 2756US2013149506A1Nonstick material, method for removing a part of a planar material layer and multilayer structure and use thereforAUSTRIA TECH & SYSTEM TECH·Filed 2013·Application pending·0 cites
- 2855US2023092954A1Electronic Package with Components Mounted at Two Sides of a Layer StackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Application pending·0 cites
- 2954US12096555B2Component carrier with stack-stack connection for connecting componentsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Sep 17, 2024·0 cites·14 claims
- 3053US9674960B2Printed circuit board comprising an electronic component integrated thereinAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Jun 6, 2017·0 cites·10 claims
- 3152US11277907B2Component carrier with exposed layerAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Mar 15, 2022·0 cites·17 claims
- 3251US2025062261A1Package with ic substrate and electronic component connected with direct physical contactAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 3351US2014216795A1Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 3450US12424504B2Component embedded in component carrier and having an exposed side wallAT&SAUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 3550US11778751B2Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier featureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Oct 3, 2023·0 cites·19 claims
- 3650US9055706B2Method for integrating an electronic component into a printed circuit boardSTAHR JOHANNES·Filed 2011·Granted Jun 9, 2015·0 cites·11 claims
- 3750US2018257364A1Use of nonstick material for the production of cavities in a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2018·Application pending·0 cites
- 3847US2022190464A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an AntennaAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Application pending·0 cites
- 3946US10939563B2Flame retardant structure for component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Mar 2, 2021·0 cites·15 claims
- 4046US10880988B2Highly thermally conductive dielectric structure for heat spreading in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Dec 29, 2020·0 cites·15 claims
- 4146US10045443B2Matching inclination of cavity sidewall and medium supply device for manufacturing component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Aug 7, 2018·0 cites·17 claims
- 4245US10790234B2Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Sep 29, 2020·0 cites·10 claims
- 4344US10165685B2Printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Dec 25, 2018·0 cites·13 claims
- 4444US2024258105A1Compound semiconductor layered structures and processes for making the sameUMICORE NV·Filed 2022·Application pending·0 cites
- 4543US2014373350A1Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a MethodAUSTRIA TECH & SYSTEM TECH·Filed 2012·Application pending·0 cites
- 4643US2024292518A9Component Carrier For Waveguide ApplicationsAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Application pending·0 cites
- 4743US2024128080A1Compound semiconductor layered structure and process for preparing the sameUMICORE NV·Filed 2022·Application pending·0 cites
- 4841US11570897B2Component embedded in component carrier and having an exposed side wallAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Jan 31, 2023·0 cites·19 claims
- 4941US10321558B2Printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jun 11, 2019·0 cites·5 claims
- 5040US10736222B2Cooling component carrier material by carbon structure within dielectric shellAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Aug 4, 2020·0 cites·23 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →