Assignee
AUSTRIA TECH & SYSTEM TECH
AT·35 granted patents·29 pending applications·107 citations·filing 2004–2025
Top patents by PatentIndex Score
64 records- 0190US10410963B1Deformed layer for short electric connection between structures of electric deviceAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Sep 10, 2019·11 cites·20 claims
- 0287US7551454B2Thin-film assembly and method for producing said assemblyAUSTRIA TECH & SYSTEM TECH·Filed 2004·Granted Jun 23, 2009·70 cites·37 claims
- 0386US10713450B2Ambient backscatter communication with devices having a circuit carrier with embedded communication equipmentAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Jul 14, 2020·6 cites·19 claims
- 0483US10332818B2Efficient heat removal from component carrier with embedded diodeAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Jun 25, 2019·4 cites·13 claims
- 0581US11129314B2Stepped component assembly accommodated within a stepped cavity in component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2019·Granted Sep 21, 2021·3 cites·15 claims
- 0679US10420206B2Component carrier comprising a deformation counteracting structureAUSTRIA TECH & SYSTEM TECH·Filed 2016·Granted Sep 17, 2019·3 cites·18 claims
- 0775US10349521B2Component carrier with adhesion promoting shape of wiring structureAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Jul 9, 2019·2 cites·14 claims
- 0872US2026068043A1Component carrier and method for manufacturing a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2025·Application pending·0 cites
- 0970US10368448B2Method of manufacturing a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Jul 30, 2019·1 cites·16 claims
- 1069US10383208B2Hybrid component carrier and method for manufacturing the sameAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Aug 13, 2019·1 cites·19 claims
- 1167US11201119B2RF functionality and electromagnetic radiation shielding in a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Dec 14, 2021·1 cites·19 claims
- 1267US8039755B2Method for manufacturing a printed circuit board element as well as a printed circuit board elementAUSTRIA TECH & SYSTEM TECH·Filed 2009·Granted Oct 18, 2011·2 cites·11 claims
- 1366US9867284B2Warpage control with intermediate materialAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jan 9, 2018·2 cites·20 claims
- 1465US10356904B2Conductor track with enlargement-free transition between conductor path and contact structureAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jul 16, 2019·1 cites·18 claims
- 1564US11749573B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2021·Granted Sep 5, 2023·0 cites·9 claims
- 1659US2026068724A1Component carrier, method for manufacturing a component carrier and component carrier assemblyAUSTRIA TECH & SYSTEM TECH·Filed 2025·Application pending·0 cites
- 1758US2024329163A1Monitoring unit comprising an integrated magnetic field sensorAUSTRIA TECH & SYSTEM TECH·Filed 2024·Application pending·0 cites
- 1857US11049778B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2019·Granted Jun 29, 2021·0 cites·8 claims
- 1957US2025070005A1Ic substrate having central section with vertically stacked functional volume sectionsAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 2056US2025194018A1Component carrier and method for manufacturing a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2024·Application pending·0 cites
- 2156US2025038117A1Ic substrate with support structure and functional inlays thereinAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 2256US2013149506A1Nonstick material, method for removing a part of a planar material layer and multilayer structure and use thereforAUSTRIA TECH & SYSTEM TECH·Filed 2013·Application pending·0 cites
- 2355US2020053864A1Method of manufacturing a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2019·Application pending·0 cites
- 2455US2026003141A1Package having component carrier and embedded optical and electric chips with horizontal signal path in betweenAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 2551US10492288B2Method of manufacturing a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Nov 26, 2019·0 cites·4 claims
- 2651US2025062261A1Package with ic substrate and electronic component connected with direct physical contactAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 2751US2025285925A1Component Carrier and Method of Manufacturing the SameAUSTRIA TECH & SYSTEM TECH·Filed 2025·Application pending·0 cites
- 2851US2015014021A1Printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 2951US2014216795A1Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 3050US2018257364A1Use of nonstick material for the production of cavities in a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2018·Application pending·0 cites
- 3150US2026040432A1Component carrier with signal conductive element and shielding conductive structureAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 3248US10424541B2Component carrier and method for manufacturing the sameAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Sep 24, 2019·0 cites·17 claims
- 3348US2009184090A1Thin-film assembly and method for producing said assemblyAUSTRIA TECH & SYSTEM TECH·Filed 2009·Application pending·0 cites
- 3448US2025040028A1Rf front-end functionality integrated in a component carrier stackAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 3547US10426040B2Method for producing a circuit board elementAUSTRIA TECH & SYSTEM TECH·Filed 2014·Granted Sep 24, 2019·0 cites·21 claims
- 3647US2014307403A1Method for integrating an electronic component into a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 3746US10045443B2Matching inclination of cavity sidewall and medium supply device for manufacturing component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Aug 7, 2018·0 cites·17 claims
- 3846US7552525B2Method for the production of a circuit board elementAUSTRIA TECH & SYSTEM TECH·Filed 2005·Granted Jun 30, 2009·0 cites·15 claims
- 3946US2025300089A1Component carrier, method for manufacturing thereof and package comprising a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2025·Application pending·0 cites
- 4044US10643953B2Electronic component packaged in component carrier serving as shielding cageAUSTRIA TECH & SYSTEM TECH·Filed 2016·Granted May 5, 2020·0 cites·4 claims
- 4143US2014373350A1Method for the Production of a Circuit Board Involving the Removal of a Subregion thereof, and Use of such a MethodAUSTRIA TECH & SYSTEM TECH·Filed 2012·Application pending·0 cites
- 4243US2015334841A1Printed Circuit BoardAUSTRIA TECH & SYSTEM TECH·Filed 2013·Application pending·0 cites
- 4342US2025309013A1Component carrier, method for manufacturing a component carrier and a package comprising a component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2025·Application pending·0 cites
- 4441US11410965B2Electronic device with embedded component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Aug 9, 2022·0 cites·12 claims
- 4541US11178772B2Component carrier connected with a separate tilted component carrier for short electric connectionAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Nov 16, 2021·0 cites·18 claims
- 4641US11171070B2Component carrier with integrated thermally conductive cooling structuresAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Nov 9, 2021·0 cites·12 claims
- 4741US10905016B2Using a partially uncured component carrier body for manufacturing component carrierAUSTRIA TECH & SYSTEM TECH·Filed 2016·Granted Jan 26, 2021·0 cites·20 claims
- 4841US10709023B2Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrateAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jul 7, 2020·0 cites·18 claims
- 4941US10321558B2Printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jun 11, 2019·0 cites·5 claims
- 5041US2015189763A1Method for Embedding at Least One Component in a Printed Circuit BoardAUSTRIA TECH & SYSTEM TECH·Filed 2013·Application pending·0 cites
Showing the top 50 of 64 patent records by PatentIndex Score.
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →