Method for integrating an electronic component into a printed circuit board

Abstract

This publication discloses a circuit-board construction and a method for manufacturing an electronic module, in which method at least one component ( 6 ) is embedded inside an insulating-material layer ( 1 ) and contacts ( 14 ) are made to connect the component ( 6 ) electrically to the conductor structures ( 14, 19 ) contained in the electronic module. According to the invention, at least one thermal via ( 22 ), which boosts the conducting of heat away from the component ( 6 ) is manufactured in the insulating-material layer ( 1 ) in the vicinity of the component ( 6 ).

1 . A printed circuit board including at least one integrated electronic component, comprising a layer for supporting the electronic component, to which the at least one electronic component is fixed by means of an adhesive, wherein, after the fixation of the electronic component, at least one electrically conductive layer is arranged on or at the component and patterned in accordance with the contacts of the electronic component and/or conductor tracks or the printed circuit board, wherein, on the side of the electronic component remote from the electrically conductive layer, particularly in the region of fixation of the electronic component, at least one opening is formed for the removal of heat and/or for contacting the component. 
     
     
         2 . The printed circuit board according to  claim 1 , wherein the electronic component is surrounded by an insulating material, in particular a prepreg film and/or an insulating resin. 
     
     
         3 . The printed circuit board according to  claim 1 , wherein a plurality of layers embedding the component and made of insulating and/or conductive materials are provided. 
     
     
         4 . The printed circuit board according to  claim 1 , wherein at least one opening for the removal of heat is provided in the particularly insulating material surrounding the electronic component, particularly in the region of fixation of the electronic component.