Inventor · disambiguated record
Mike Morianz
Also filed as: MORIANZ MIKE
13 granted patents·6 pending applications·22 citations·filing 2003–2022
86Inventor score
Files withAT & S AUSTRIA TECH & SYSTEMTECHNIK AG12AUSTRIA TECH & SYSTEM TECH4HASLEBNER NIKOLAI1HUEMER PHILIPP1WEICHSLBERGER GÜNTHER1
Top patents by PatentIndex Score
19 records- 0184US10219384B2Circuit board structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Feb 26, 2019·6 cites·9 claims
- 0283US10332818B2Efficient heat removal from component carrier with embedded diodeAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Jun 25, 2019·4 cites·13 claims
- 0380US11324122B2Component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 3, 2022·1 cites·14 claims
- 0477US11172576B2Method for producing a printed circuit board structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Nov 9, 2021·2 cites·11 claims
- 0569US8789271B2Method for integrating an electronic component into a printed circuit boardWEICHSLBERGER GÜNTHER·Filed 2009·Granted Jul 29, 2014·7 cites·13 claims
- 0665US10645816B2Method for contacting and rewiring an electronic component embedded into a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted May 5, 2020·1 cites·4 claims
- 0765US10356904B2Conductor track with enlargement-free transition between conductor path and contact structureAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jul 16, 2019·1 cites·18 claims
- 0863US11570904B2Method for contacting and rewiring an electronic component embedded into a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jan 31, 2023·0 cites·18 claims
- 0959US2019306983A1Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Application pending·0 cites
- 1058US12245377B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Mar 4, 2025·0 cites·26 claims
- 1154US11495513B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 1247US2022190464A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed Structure Forming an AntennaAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Application pending·0 cites
- 1347US2014307403A1Method for integrating an electronic component into a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 1444US2024014142A1Component Carrier With Electronic Components and Thermally Conductive Blocks on Both SidesAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Application pending·0 cites
- 1541US10321558B2Printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jun 11, 2019·0 cites·5 claims
- 1640US2019110366A1Component Carrier Having at Least a Part Formed as a Three-Dimensionally Printed StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Application pending·0 cites
- 1735US9226390B2Method for producing a circuit board consisting of a plurality of circuit board areas and circuit boardHASLEBNER NIKOLAI·Filed 2011·Granted Dec 29, 2015·0 cites·5 claims
- 1834US11058004B2Metallic layer as carrier for component embedded in cavity of component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jul 6, 2021·0 cites·12 claims
- 1925US2006139831A1Electrical subassembly and use thereofHUEMER PHILIPP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →