Inventor · disambiguated record
Mark J. Beesley
Also filed as: BEESLEY MARK · BEESLEY MARK J
11 granted patents·4 pending applications·61 citations·filing 2009–2024
87Inventor score
Top patents by PatentIndex Score
15 records- 0197US10191550B1Fabric devices with shape memory alloy wires that provide haptic feedbackAPPLE INC·Filed 2017·Granted Jan 29, 2019·34 cites·17 claims
- 0295US10485103B1Electrical components attached to fabricAPPLE INC·Filed 2017·Granted Nov 19, 2019·16 cites·21 claims
- 0384US11388817B2Electrical components attached to fabricAPPLE INC·Filed 2021·Granted Jul 12, 2022·1 cites·20 claims
- 0479US12376231B2Three-dimensional (3D) copper in printed circuit boardsAPPLE INC·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
- 0575US2022346228A1Electrical Components Attached to FabricAPPLE INC·Filed 2022·Application pending·0 cites
- 0674US10455707B1Connection pad for embedded components in PCB packagingAPPLE INC·Filed 2018·Granted Oct 22, 2019·3 cites·23 claims
- 0771US10959331B2Electrical components attached to fabricAPPLE INC·Filed 2020·Granted Mar 23, 2021·0 cites·20 claims
- 0869US8789271B2Method for integrating an electronic component into a printed circuit boardWEICHSLBERGER GÜNTHER·Filed 2009·Granted Jul 29, 2014·7 cites·13 claims
- 0966US11956898B2Three-dimensional (3D) copper in printed circuit boardsAPPLE INC·Filed 2020·Granted Apr 9, 2024·0 cites·17 claims
- 1064US10701802B2Electrical components attached to fabricAPPLE INC·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 1159US12035466B2Systems and methods for manufacturing thin substrateAPPLE INC·Filed 2021·Granted Jul 9, 2024·0 cites·29 claims
- 1252US2024314479A1Embedded waterproof membraneAPPLE INC·Filed 2024·Application pending·0 cites
- 1347US2014307403A1Method for integrating an electronic component into a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
- 1437US10420213B2Segmented via for vertical PCB interconnectAPPLE INC·Filed 2017·Granted Sep 17, 2019·0 cites·20 claims
- 1536US2017083042A1Surface shaping of device packages to mitigate fractures under bending stressAPPLE INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →