Inventor · disambiguated record
Johannes Stahr
Also filed as: STAHR JOHANNES
47 granted patents·20 pending applications·108 citations·filing 2004–2025
97Inventor score
Files withAT & S AUSTRIA TECH & SYSTEMTECHNIK AG38AUSTRIA TECH & SYSTEM TECH15STAHR JOHANNES3WEIDINGER GERALD3WEICHSLBERGER GUENTHER2
Top patents by PatentIndex Score
67 records- 0191US10665526B2Component carrier comprising at least one heat pipe and method for producing said component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted May 26, 2020·8 cites·12 claims
- 0291US9418930B2Power moduleAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Aug 16, 2016·14 cites·9 claims
- 0389US10617012B2Methods of manufacturing flexible printed circuit boardsAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Apr 7, 2020·5 cites·16 claims
- 0489US9781845B2Semi-finished product for the production of a printed circuit board and method for producing the sameAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Oct 3, 2017·9 cites·7 claims
- 0588US10779413B2Method of embedding a component in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Sep 15, 2020·8 cites·13 claims
- 0685US9253888B2Method for integrating an electronic component into a printed circuit board or a printed circuit board intermediate product, and printed circuit board or printed circuit board intermediate productWEIDINGER GERALD·Filed 2012·Granted Feb 2, 2016·9 cites·18 claims
- 0784US10219384B2Circuit board structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2014·Granted Feb 26, 2019·6 cites·9 claims
- 0884US10187997B2Method for making contact with a component embedded in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Jan 22, 2019·5 cites·7 claims
- 0983US10332818B2Efficient heat removal from component carrier with embedded diodeAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Jun 25, 2019·4 cites·13 claims
- 1080US11324122B2Component carrier and method of manufacturing the sameAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 3, 2022·1 cites·14 claims
- 1177US11172576B2Method for producing a printed circuit board structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Nov 9, 2021·2 cites·11 claims
- 1276US2025227850A1Method for Embedding a Component in a Printed Circuit BoardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2025·Application pending·0 cites
- 1375US12185478B2Printed circuit board having embedded componentAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Dec 31, 2024·0 cites·19 claims
- 1475US8685196B2Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodWEICHSLBERGER GUENTHER·Filed 2010·Granted Apr 1, 2014·5 cites·37 claims
- 1575US8500938B2Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit boardSTAHR JOHANNES·Filed 2008·Granted Aug 6, 2013·7 cites·15 claims
- 1675US2025062171A1Component Carrier With Surface-Contactable Component Embedded in Laminated StackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2024·Application pending·0 cites
- 1774US12002614B2Inductor made of component carrier material comprising electrically conductive plate structuresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jun 4, 2024·0 cites·17 claims
- 1873US11523520B2Method for making contact with a component embedded in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Dec 6, 2022·1 cites·25 claims
- 1971US12482595B2Component carrier with embedded magnetic inlay and integrated coil structureAT&S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Granted Nov 25, 2025·0 cites·19 claims
- 2071US8388792B2Nonstick material, method for removing a part of a planar material layer and multilayer structure and use thereforWEIDINGER GERALD·Filed 2008·Granted Mar 5, 2013·4 cites·5 claims
- 2169US10283680B2Method for the production of an electronic module having an electronic component embedded thereinAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2016·Granted May 7, 2019·1 cites·15 claims
- 2269US8789271B2Method for integrating an electronic component into a printed circuit boardWEICHSLBERGER GÜNTHER·Filed 2009·Granted Jul 29, 2014·7 cites·13 claims
- 2369US2024030095A1Electronic Package Comprising a Decoupling Layer StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2023·Application pending·0 cites
- 2467US8039755B2Method for manufacturing a printed circuit board element as well as a printed circuit board elementAUSTRIA TECH & SYSTEM TECH·Filed 2009·Granted Oct 18, 2011·2 cites·11 claims
- 2565US12501551B2Method for embedding a component in a printed circuit boardAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 16, 2025·0 cites·10 claims
- 2665US10863631B2Layer stack of component carrier material with embedded components and common high temperature robust dielectric structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Dec 8, 2020·1 cites·20 claims
- 2765US10861636B2Inductor made of component carrier material comprising electrically conductive plate structuresAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2017·Granted Dec 8, 2020·0 cites·15 claims
- 2865US10356904B2Conductor track with enlargement-free transition between conductor path and contact structureAUSTRIA TECH & SYSTEM TECH·Filed 2015·Granted Jul 16, 2019·1 cites·18 claims
- 2964US11749573B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2021·Granted Sep 5, 2023·0 cites·9 claims
- 3061US10867888B2Component carrier comprising at least one heat pipe and method for producing said component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 15, 2020·0 cites·20 claims
- 3161US8541690B2Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic componentVORABERGER HANNES·Filed 2007·Granted Sep 24, 2013·4 cites·21 claims
- 3261US8541689B2Method for removing a part of a planar material layer and multilayer structureWEIDINGER GERALD·Filed 2008·Granted Sep 24, 2013·2 cites·21 claims
- 3359US12165940B2Component carrier with surface-contactable component embedded in laminated stackAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Dec 10, 2024·0 cites·8 claims
- 3459US2019221718A1Method for the Production of an Electronic Module Having an Electronic Component Embedded ThereinAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Application pending·0 cites
- 3559US2019306983A1Conductor Track With Enlargement-Free Transition Between Conductor Path and Contact StructureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Application pending·0 cites
- 3658US12245377B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2022·Granted Mar 4, 2025·0 cites·26 claims
- 3758US2020205296A1Methods of Manufacturing Flexible Electronic DevicesAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Application pending·0 cites
- 3858US2024329163A1Monitoring unit comprising an integrated magnetic field sensorAUSTRIA TECH & SYSTEM TECH·Filed 2024·Application pending·0 cites
- 3957US11049778B2Component carrier with a stepped cavity and a stepped component assembly embedded within the stepped cavityAUSTRIA TECH & SYSTEM TECH·Filed 2019·Granted Jun 29, 2021·0 cites·8 claims
- 4057US8705905B2Printed circuit board element and method for the production thereofLANGER GREGOR·Filed 2008·Granted Apr 22, 2014·2 cites·17 claims
- 4156US2013149506A1Nonstick material, method for removing a part of a planar material layer and multilayer structure and use thereforAUSTRIA TECH & SYSTEM TECH·Filed 2013·Application pending·0 cites
- 4255US11682661B2Hermetic optical component package having organic portion and inorganic portionAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Jun 20, 2023·0 cites·13 claims
- 4354US11792932B2Component carrier with embedded magnetic inlay and integrated coil structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Oct 17, 2023·0 cites·20 claims
- 4454US11495513B2Component carrier with embedded semiconductor component and embedded highly-conductive block which are mutually coupledAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted Nov 8, 2022·0 cites·20 claims
- 4553US11658142B2Connection arrangement, component carrier and method of forming a component carrier structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2020·Granted May 23, 2023·0 cites·15 claims
- 4653US9674960B2Printed circuit board comprising an electronic component integrated thereinAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2015·Granted Jun 6, 2017·0 cites·10 claims
- 4751US11799198B2Component carrier-based device with antenna coupling of electronic component and thermal coupling on opposing sidesAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2021·Granted Oct 24, 2023·0 cites·20 claims
- 4851US2025062261A1Package with ic substrate and electronic component connected with direct physical contactAUSTRIA TECH & SYSTEM TECH·Filed 2023·Application pending·0 cites
- 4951US2022377917A1Component Carrier With Magnetic Element, Magnetic Inlay, and Manufacturing MethodSTAHR JOHANNES·Filed 2022·Application pending·0 cites
- 5051US2014216795A1Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a methodAUSTRIA TECH & SYSTEM TECH·Filed 2014·Application pending·0 cites
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →