Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor

Abstract

The invention relates to a nonstick material for use during removal of a part ( 11 ) of a substantially planar material layer ( 2 ) which is connected in a connecting step to at least on further, substantially planar material layer ( 9 ). According to the invention, the nonstick material ( 8 ) has a different polarity than the adjoining, substantially planar material layers ( 2, 9 ). The invention also relates to a method for removing a part ( 11 ) of a substantially planar material layer ( 2 ) which is connected in a connecting step to at least one further, substantially planar material layer ( 9 ), to a multilayer structure which consists of at least two substantially planar material layers ( 2, 9 ) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.

1 - 27 . (canceled) 
     
     
         28 . An anti-adhesion or nonstick material for use in the removal of a part or subportion of a substantially flat or planar material layer which is bonded with at least one further substantially flat material layer in a bonding procedure by raising the temperature, wherein the anti-adhesion material comprises a difference in polarity relative to the adjoining substantially flat material layers. 
     
     
         29 . The anti-adhesion material according to  claim 28 , wherein the anti-adhesion material comprises a separating component, a binder and a solvent. 
     
     
         30 . The anti-adhesion material according to  claim 28 , wherein the anti-adhesion material comprises hydrocarbon waxes and oils, waxes and oils based on polyethylene or polypropylene compounds, waxes and oils based on organic polyfluoro compounds, esters of fatty acids and alcohols or polyamides, silicoorganic compounds and/or mixtures thereof. 
     
     
         31 . The anti-adhesion material according to  claim 28 , wherein the anti-adhesion material is comprised of a paste. 
     
     
         32 . The anti-adhesion material according to  claim 28 , wherein the anti-adhesion material is applicable by a printing process and, in particular, screen-printing, stencil-printing, offset printing, flexoprinting, tampon printing, ink-jet printing or the like. 
     
     
         33 . The anti-adhesion material according to  claim 28 , wherein the anti-adhesion material is provided with inorganic and/or organic fillers and additives. 
     
     
         34 . The anti-adhesion material according to  claim 28 , wherein the anti-adhesion material has a softening or melting point of at least 100° C. and, in particular, 120° C. 
     
     
         35 . The anti-adhesion material according to  claim 28 , wherein the anti-adhesion material is applicable in a layer thickness of less than 25 μm and, in particular, less than 15 μm. 
     
     
         36 . The anti-adhesion material according to  claim 28 , wherein the solvent has a boiling point of less than 220° C. and, in particular, about 180 to 200° C. 
     
     
         37 . The anti-adhesion material according to  claim 28 , wherein a cellulose derivative or a water-soluble and, preferably, alkali-saponifiable, compound is contained as said binder. 
     
     
         38 . The multilayer structure formed by at least two substantially flat material layers to be bonded with each other, wherein, in the region of a subportion to be removed after having realized the bonding between the material layers, an area kept free from direct bonding between the material layers to be bonded is provided by the application of an anti-adhesion material according  claim 28 . 
     
     
         39 . The multilayer structure according to  claim 38 , wherein the anti-adhesion material is applied in a layer thickness of less than 25 μm and, in particular, less than 15 μm. 
     
     
         40 . The multilayer structure according to  claim 38 , wherein the substantially flat material layers to be bonded are formed by layers of a multilayer printed circuit board. 
     
     
         41 . The multilayer structure according to  claim 38 , wherein the material layers to be bonded are bonded by a lamination process. 
     
     
         42 . The multilayer structure according to  claim 38 , wherein edge regions of the subportion to be removed are definable and/or removable by milling, scratching, cutting, in particular laser-cutting. 
     
     
         43 . The use of an anti-adhesion or nonstick material according to  claim 28 , for the production of a multilayer printed circuit board. 
     
     
         44 . The use according to  claim 43  for the production of cavities, in particular three-dimensional cavities, in a printed circuit board. 
     
     
         45 . The use according to  claim 43  for the production of at least one channel in a printed circuit board. 
     
     
         46 . The use according to  claim 43  for the non-bonding of at least one element, in particular registering element, in the interior or within internal layers of a multilayer printed circuit board. 
     
     
         47 . The use according to  claim 43  for the production of offset and/or stepped subportions of a printed circuit board. 
     
     
         48 . The use according to  claim 43  for the production of a rigid-flexible printed circuit board.