Use of nonstick material for the production of cavities in a printed circuit board

Abstract

The invention relates to a nonstick material for use during removal of a part ( 11 ) of a substantially planar material layer ( 2 ) which is connected in a connecting step to at least on further, substantially planar material layer ( 9 ). According to the invention, the nonstick material ( 8 ) has a different polarity than the adjoining, substantially planar material layers ( 2, 9 ). The invention also relates to a method for removing a part ( 11 ) of a substantially planar material layer ( 2 ) which is connected in a connecting step to at least one further, substantially planar material layer ( 9 ), to a multilayer structure which consists of at least two substantially planar material layers ( 2, 9 ) to be interconnected, and to a use of the same, especially in a multilayer printed circuit board.

1 . The use of an anti-adhesion or nonstick material for the production of cavities, in particular three-dimensional cavities, in a multilayer printed circuit board,
 wherein the anti-adhesion or nonstick material is configured for use in the removal of a part or subportion of a substantially flat or planar material layer which is bonded with at least one further substantially flat material layer in a bonding procedure by raising the temperature, and   wherein the anti-adhesion material comprises a difference in polarity relative to the adjoining substantially flat material layers.   
     
     
         2 . The use according to  claim 1  for the production of at least one channel in a printed circuit board. 
     
     
         3 . The use according to  claim 1  for the non-bonding of at least one element, in particular registering element, in the interior or within internal layers of a multilayer printed circuit board. 
     
     
         4 . The use according to  claim 1  for the production of offset and/or stepped subportions of a printed circuit board. 
     
     
         5 . The use according to  claim 1  for the production of a rigid-flexible printed circuit board. 
     
     
         6 . The use according to  claim 1 , wherein the anti-adhesion material comprises a separating component, a binder and a solvent. 
     
     
         7 . The use according to  claim 1 , wherein the anti-adhesion material comprises hydrocarbon waxes and oils, waxes and oils based on polyethylene or polypropylene compounds, waxes and oils based on organic polyfluoro compounds, esters of fatty acids and alcohols or polyamides, silicoorganic compounds and/or mixtures thereof. 
     
     
         8 . The use according to  claim 1 , wherein the anti-adhesion material is comprised of a paste. 
     
     
         9 . The use according to  claim 1 , wherein the anti-adhesion material is applicable by a printing process and, in particular, screen-printing, stencil-printing, offset printing, flexoprinting, tampon printing, ink-jet printing or the like. 
     
     
         10 . The use according to  claim 1 , wherein the anti-adhesion material is provided with inorganic and/or organic fillers and additives. 
     
     
         11 . The use according to  claim 1 , wherein the anti-adhesion material has a softening or melting point of at least 100° C. and, in particular, 120° C. 
     
     
         12 . The use according to  claim 1 , wherein the anti-adhesion material is applicable in a layer thickness of less than 25 μm and, in particular, less than 15 μm. 
     
     
         13 . The use according to  claim 1 , wherein the solvent has a boiling point of less than 220° C. and, in particular, about 180 to 200° C. 
     
     
         14 . The use according to  claim 1 , wherein a cellulose derivative or a water-soluble and, preferably, alkali-saponifiable, compound is contained as said binder. 
     
     
         15 . The use according to  claim 1 , wherein in the multilayer structure formed by the at least two substantially flat material layers to be bonded with each other, in the region of a subportion to be removed after having realized the bonding between the material layers, an area kept free from direct bonding between the material layers to be bonded is provided by the application of the anti-adhesion material. 
     
     
         16 . The use according to  claim 15 , wherein the anti-adhesion material is applied in a layer thickness of less than 25 μm and, in particular, less than 15 μm in the multilayer structure. 
     
     
         17 . The use according to  claim 15 , wherein the substantially flat material layers to be bonded are formed by layers of the multilayer printed circuit board. 
     
     
         18 . The use according to  claim 15 , wherein the material layers to be bonded are bonded by a lamination process. 
     
     
         19 . The use according to  claim 15 , wherein edge regions of the subportion to be removed are definable and/or removable by milling, scratching, cutting, in particular laser-cutting.