Assignee
BAE JOHYUN
KR·4 granted patents·7 citations·filing 2010–2014
Top patents by PatentIndex Score
4 records- 0183US8698297B2Integrated circuit packaging system with stack deviceBAE JOHYUN·Filed 2011·Granted Apr 15, 2014·6 cites·4 claims
- 0257US8643181B2Integrated circuit packaging system with encapsulation and method of manufacture thereofBAE JOHYUN·Filed 2010·Granted Feb 4, 2014·1 cites·20 claims
- 0353US9349666B1Integrated circuit packaging system with package stackingBAE JOHYUN·Filed 2014·Granted May 24, 2016·0 cites·6 claims
- 0449US8461680B2Integrated circuit packaging system with rounded interconnectBAE JOHYUN·Filed 2011·Granted Jun 11, 2013·0 cites·16 claims
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