Assignee
BCHIR OMAR J
US·3 granted patents·5 pending applications·9 citations·filing 2007–2011
Top patents by PatentIndex Score
8 records- 0177US7583871B1Substrates for optical die structuresBCHIR OMAR J·Filed 2008·Granted Sep 1, 2009·8 cites·23 claims
- 0256US8742603B2Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)BCHIR OMAR J·Filed 2010·Granted Jun 3, 2014·1 cites·13 claims
- 0351US2009166858A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2007·Application pending·0 cites
- 0450US2011123725A1Method of enabling selective area plating on a substrateBCHIR OMAR J·Filed 2011·Application pending·0 cites
- 0548US2010301484A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2010·Application pending·0 cites
- 0644US2009047783A1Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using sameBCHIR OMAR J·Filed 2007·Application pending·0 cites
- 0743US8703602B2Selective seed layer treatment for feature platingBCHIR OMAR J·Filed 2010·Granted Apr 22, 2014·0 cites·11 claims
- 0833US2012090883A1Method and Apparatus for Improving Substrate WarpageBCHIR OMAR J·Filed 2011·Application pending·0 cites
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