Method of enabling selective area plating on a substrate

Abstract

A method of enabling selective area plating on a substrate includes forming a first electrically conductive layer ( 310 ) over substantially all of the substrate, covering sections of the first electrically conductive layer with a mask ( 410 ) such that the first electrically conductive layer has a masked portion and an unmasked portion, forming a second electrically conductive layer ( 710, 1210 ), the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer, and removing the mask and the masked portion of the first electrically conductive layer. In an embodiment, the mask covering sections of the first electrically conductive layer is a non-electrically conductive substance ( 1010 ) applied with a stamp ( 1020 ). In an embodiment, the mask is a black oxide layer.

1 . A method of enabling selective area plating on a substrate, the method comprising:
 forming a first electrically conductive layer over substantially all of the substrate;   covering sections of the first electrically conductive layer with a mask such that the first electrically conductive layer has a masked portion and an unmasked portion;   forming a second electrically conductive layer, the second electrically conductive layer forming only over the unmasked portion of the first electrically conductive layer; and   removing the mask and the masked portion of the first electrically conductive layer.   
     
     
         2 . The method of  claim 1  wherein:
 covering sections of the first electrically conductive layer comprises applying a non-electrically conductive substance to sections of the first electrically conductive layer. 
 
     
     
         3 . The method of  claim 2  wherein:
 applying the non-electrically conductive substance comprises:
 providing a stamp; 
 applying the non-electrically conductive substance to the stamp; and 
 stamping the first electrically conductive layer such that a layer of the non-electrically conductive substance is transferred to the sections of the first electrically conductive layer. 
 
 
     
     
         4 . A method of enabling selective area plating on a substrate, the method comprising:
 patterning the substrate in order to form a feature therein;   forming a first electrically conductive layer over the substrate;   providing a stamp;   applying a non-electrically conductive substance to the stamp;   pressing the stamp onto the first electrically conductive layer such that a layer of the non-electrically conductive substance is transferred to the first electrically conductive layer;   forming a second electrically conductive layer over portions of the first electrically conductive layer;   removing the non-electrically conductive substance; and   removing portions of the first electrically conductive layer.   
     
     
         5 . The method of  claim 4  wherein:
 patterning the substrate comprises forming the feature using an excimer laser. 
 
     
     
         6 . The method of  claim 5  wherein:
 forming the first electrically conductive layer comprises electrolessly depositing a first copper layer over the substrate. 
 
     
     
         7 . The method of  claim 5  wherein:
 applying the non-electrically conductive substance comprises applying a polymer to a surface of the stamp. 
 
     
     
         8 . The method of  claim 7  wherein:
 applying the polymer comprises:
 providing a solution comprising the polymer and a solvent; and 
 placing the solution on the stamp. 
 
 
     
     
         9 . The method of  claim 8  wherein:
 placing the solution on the stamp comprises brushing the stamp with the solution. 
 
     
     
         10 . The method of  claim 8  wherein:
 placing the solution on the stamp comprises spin coating or roller coating the solution onto the stamp. 
 
     
     
         11 . The method of  claim 8  further comprising:
 performing a plasma treatment on the stamp prior to placing the solution on the stamp. 
 
     
     
         12 . The method of  claim 5  wherein:
 forming the second electrically conductive layer comprises electroplating the substrate with a second copper layer.