Inventor · disambiguated record
Omar J. Bchir
Also filed as: BCHIR OMAR · BCHIR OMAR J · BCHIR OMAR JAMES
42 granted patents·24 pending applications·208 citations·filing 2001–2024
97Inventor score
Top patents by PatentIndex Score
66 records- 0197US9379090B1System, apparatus, and method for split die interconnectionQUALCOMM INC·Filed 2015·Granted Jun 28, 2016·43 cites·27 claims
- 0293US9642259B2Embedded bridge structure in a substrateQUALCOMM INC·Filed 2013·Granted May 2, 2017·18 cites·30 claims
- 0392US8772951B1Ultra fine pitch and spacing interconnects for substrateQUALCOMM INC·Filed 2013·Granted Jul 8, 2014·16 cites·24 claims
- 0491US9806063B2Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliabilityQUALCOMM INC·Filed 2015·Granted Oct 31, 2017·9 cites·23 claims
- 0590US9679841B2Substrate and method of forming the sameQUALCOMM INC·Filed 2014·Granted Jun 13, 2017·11 cites·21 claims
- 0687US9484327B2Package-on-package structure with reduced heightQUALCOMM INC·Filed 2013·Granted Nov 1, 2016·10 cites·10 claims
- 0786US12453210B2Optoelectronic module packageROCKLEY PHOTONICS LTD·Filed 2022·Granted Oct 21, 2025·1 cites·12 claims
- 0886US8368232B2Sacrificial material to facilitate thin die attachQUALCOMM INC·Filed 2010·Granted Feb 5, 2013·8 cites·20 claims
- 0984US10928585B2Semiconductor devices having electro-optical substratesMICRON TECHNOLOGY INC·Filed 2018·Granted Feb 23, 2021·3 cites·20 claims
- 1083US11024617B2Semiconductor packages having photon integrated circuit (PIC) chipsMICRON TECHNOLOGY INC·Filed 2018·Granted Jun 1, 2021·3 cites·4 claims
- 1183US9159670B2Ultra fine pitch and spacing interconnects for substrateQUALCOMM INC·Filed 2014·Granted Oct 13, 2015·5 cites·38 claims
- 1281US11525956B2Semiconductor devices having electro-optical substratesMICRON TECHNOLOGY INC·Filed 2021·Granted Dec 13, 2022·1 cites·18 claims
- 1379US8276269B2Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making sameJOMAA HOUSSAM·Filed 2008·Granted Oct 2, 2012·8 cites·21 claims
- 1479US6967355B2Group III-nitride on Si using epitaxial BP buffer layerUNIV FLORIDA·Filed 2003·Granted Nov 22, 2005·23 cites·15 claims
- 1577US9269681B2Surface finish on trace for a thermal compression flip chip (TCFC)QUALCOMM INC·Filed 2013·Granted Feb 23, 2016·4 cites·7 claims
- 1677US7583871B1Substrates for optical die structuresBCHIR OMAR J·Filed 2008·Granted Sep 1, 2009·8 cites·23 claims
- 1771US9601435B2Semiconductor package with embedded components and method of making the sameQUALCOMM INC·Filed 2015·Granted Mar 21, 2017·2 cites·14 claims
- 1871US7831115B2Optical die structures and associated package substratesINTEL CORP·Filed 2008·Granted Nov 9, 2010·2 cites·23 claims
- 1970US8802556B2Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2013·Granted Aug 12, 2014·2 cites·20 claims
- 2069US9461008B2Solder on trace technology for interconnect attachmentQUALCOMM INC·Filed 2013·Granted Oct 4, 2016·2 cites·23 claims
- 2167US9398699B2Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making sameJOMAA HOUSSAM·Filed 2012·Granted Jul 19, 2016·1 cites·14 claims
- 2267US9355898B2Package on package (PoP) integrated device comprising a plurality of solder resist layersQUALCOMM INC·Filed 2014·Granted May 31, 2016·2 cites·22 claims
- 2367US9040842B2Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillersINTEL CORP·Filed 2013·Granted May 26, 2015·1 cites·12 claims
- 2467US7432202B2Method of substrate manufacture that decreases the package resistanceINTEL CORP·Filed 2005·Granted Oct 7, 2008·4 cites·13 claims
- 2566US7923059B2Method of enabling selective area plating on a substrateINTEL CORP·Filed 2007·Granted Apr 12, 2011·2 cites·8 claims
- 2665US8252677B2Method of forming solder bumps on substratesBCHIR OMAR·Filed 2007·Granted Aug 28, 2012·3 cites·5 claims
- 2763US12300680B2Semiconductor packages having photon integrated circuit (PIC) chipsMICRON TECHNOLOGY INC·Filed 2021·Granted May 13, 2025·0 cites·16 claims
- 2863US9609751B2Package substrate comprising surface interconnect and cavity comprising electroless fillQUALCOMM INC·Filed 2014·Granted Mar 28, 2017·1 cites·16 claims
- 2962US8017022B2Selective electroless plating for electronic substratesINTEL CORP·Filed 2007·Granted Sep 13, 2011·1 cites·9 claims
- 3061US7538021B2Removing dry film resist residues using hydrolyzable membranesINTEL CORP·Filed 2006·Granted May 26, 2009·1 cites·11 claims
- 3161US2022109075A1Optoelectronic module packageROCKLEY PHOTONICS LTD·Filed 2021·Application pending·0 cites
- 3260US2025300056A1Integrated device with conductive pillar structure for die interconnectionQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3359US8425785B2Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillersNALLA RAVI·Filed 2008·Granted Apr 23, 2013·2 cites·10 claims
- 3459US6596888B2MOCVD of WNx thin films using imido precursorsUNIV FLORIDA·Filed 2001·Granted Jul 22, 2003·9 cites·12 claims
- 3559US2025273597A1Embedded scaffold stiffener in substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 3657US7727886B2Forming vias using sacrificial materialINTEL CORP·Filed 2007·Granted Jun 1, 2010·1 cites·11 claims
- 3756US9370097B2Package substrate with testing pads on fine pitch tracesQUALCOMM INC·Filed 2013·Granted Jun 14, 2016·0 cites·31 claims
- 3856US8742603B2Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)BCHIR OMAR J·Filed 2010·Granted Jun 3, 2014·1 cites·13 claims
- 3956US2024371736A1Substrate employing core with cavity embedding reduced height electrical device(s), and related integrated circuit (ic) packages and fabrication methodsQUALCOMM INC·Filed 2023·Application pending·0 cites
- 4056US2025300050A1Package substrateQUALCOMM INC·Filed 2024·Application pending·0 cites
- 4153US11239377B2Optoelectronic module packageROCKLEY PHOTONICS LTD·Filed 2018·Granted Feb 1, 2022·0 cites·13 claims
- 4252US2014322868A1Barrier layer on bump and non-wettable coating on traceQUALCOMM INC·Filed 2014·Application pending·0 cites
- 4351US9929097B2Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillersNALLA RAVI·Filed 2015·Granted Mar 27, 2018·0 cites·9 claims
- 4451US2009166858A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2007·Application pending·0 cites
- 4550US2011123725A1Method of enabling selective area plating on a substrateBCHIR OMAR J·Filed 2011·Application pending·0 cites
- 4648US2010301484A1Lga substrate and method of making sameBCHIR OMAR J·Filed 2010·Application pending·0 cites
- 4748US2009056989A1Printed circuit board and method for preparation thereofINTEL CORP·Filed 2007·Application pending·0 cites
- 4847US2015221528A9Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)QUALCOMM INC·Filed 2014·Application pending·0 cites
- 4946US2010300743A1Modified Pillar Design for Improved Flip Chip PackagingQUALCOMM INC·Filed 2009·Application pending·0 cites
- 5046US2008160177A1Methods for electroless plating of metal traces on a substrate and devices and systems thereofMATAYBAS J C·Filed 2006·Application pending·0 cites
Showing the top 50 of 66 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →