Optoelectronic module package

Abstract

An optoelectronic module. In some embodiments, the optoelectronic module includes: a substrate; a digital integrated circuit, on an upper surface of the substrate; and a frame, secured in a pocket of the substrate. The pocket is in a lower surface of the substrate, and the substrate includes an insulating layer, and a plurality of conductive traces.

What is claimed is: 
     
         1 . An optoelectronic module, comprising:
 a substrate;   a digital integrated circuit, on an upper surface of the substrate; and   a frame, secured in a pocket of the substrate, the pocket being in a lower surface of the substrate,   the frame being composed of a material having a thermal conductivity greater than 10 W/m/K,   the substrate comprising:
 an insulating layer, and 
 a plurality of conductive traces. 
   
     
     
         2 . The optoelectronic module of  claim 1 , wherein the substrate further comprises a copper layer on a surface of the pocket parallel to the lower surface of the substrate. 
     
     
         3 . The optoelectronic module of  claim 1 , further comprising:
 a photonic integrated circuit, and   an analog integrated circuit, connected to the photonic integrated circuit, and to the digital integrated circuit.   
     
     
         4 . The optoelectronic module of  claim 3 , wherein the analog integrated circuit is connected to the digital integrated circuit through the substrate. 
     
     
         5 . The optoelectronic module of  claim 3 , further comprising a carrier secured to an upper surface of the frame,
 the photonic integrated circuit and the analog integrated circuit being secured to an upper surface of the carrier,   the carrier comprising an insulating layer and a plurality of thermal vias forming a thermal path from the analog integrated circuit to the frame.   
     
     
         6 . The optoelectronic module of  claim 5 , wherein:
 the photonic integrated circuit is connected to the analog integrated circuit by wire bonds, and   the analog integrated circuit is connected to the substrate by wire bonds.   
     
     
         7 . The optoelectronic module of  claim 6 , further comprising a heater, in or on the photonic integrated circuit, wherein a total thermal conductivity between the photonic integrated circuit and the frame is less than 10 mW/K. 
     
     
         8 . The optoelectronic module of  claim 7 , wherein:
 the carrier comprises a plurality of conductive traces,   the heater is connected to the carrier by wire bonds, and   the carrier is connected to the substrate by wire bonds.   
     
     
         9 . The optoelectronic module of  claim 6 , further comprising a heater patterned in metal traces on the carrier. 
     
     
         10 . The optoelectronic module of  claim 3 , further comprising an optical fiber, wherein:
 the photonic integrated circuit has a V-groove, and   an end of the optical fiber is in the V-groove.   
     
     
         11 . The optoelectronic module of  claim 3 , further comprising a carrier secured to an upper surface of the frame,
 the optoelectronic module comprising an optoelectronic subassembly comprising:
 the photonic integrated circuit; 
 the analog integrated circuit; 
 the carrier; and 
 an optical fiber, coupled to an optical waveguide on the photonic integrated circuit, 
   the optoelectronic subassembly having a plurality of contact pads for establishing electrical connections between the analog integrated circuit and test equipment probes, the optoelectronic subassembly being configured to be separately testable by supplying power to the optoelectronic subassembly through one or more of the contact pads and sending data to and and/or receiving data from the optoelectronic subassembly through one or more of the contact pads.   
     
     
         12 . The optoelectronic module of  claim 1 , wherein the digital integrated circuit is secured and connected to the substrate by a first array of contacts, and
 the lower surface of the substrate has a second array of contacts.   
     
     
         13 . The optoelectronic module of  claim 12 , wherein the second array of contacts has a coarser pitch than the first array of contacts. 
     
     
         14 . The optoelectronic module of  claim 13 , further comprising a lid, on, and in thermal contact with, an upper surface of the digital integrated circuit, the lid comprising a material having a thermal conductivity of at least 10 W/m/K. 
     
     
         15 . An optoelectronic module, comprising:
 a substrate comprising an insulating layer;   an electronic integrated circuit, on an upper surface of the substrate; and   a photonic integrated circuit,   an upper surface of the substrate having a pocket,   the substrate having a copper layer on a bottom surface of the pocket,   the photonic integrated circuit being secured to the copper layer.   
     
     
         16 . The optoelectronic module of  claim 15 , wherein:
 the electronic integrated circuit overhangs the pocket and the photonic integrated circuit, and   a first array of contacts on a lower surface of the electronic integrated circuit forms connections from the electronic integrated circuit to:
 the upper surface of the substrate, and 
 an upper surface of the photonic integrated circuit. 
   
     
     
         17 . The optoelectronic module of  claim 16 , further comprising a heater, in or on the photonic integrated circuit. 
     
     
         18 . The optoelectronic module of  claim 15 , wherein:
 the substrate further comprises a plurality of conductive traces, and   the photonic integrated circuit is connected to the conductive traces by wire bonds.   
     
     
         19 . The optoelectronic module of  claim 18 , wherein the electronic integrated circuit is a digital integrated circuit. 
     
     
         20 . The optoelectronic module of  claim 19 , further comprising an analog integrated circuit, on an upper surface of the photonic integrated circuit, the analog integrated circuit being connected to the photonic integrated circuit by a second array of contacts.