Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)

Abstract

A backside mold configuration (BSMC) process for manufacturing packaged integrated circuits includes applying a mold compound to a side of a packaging substrate opposite an attached die. The mold compound is deposited on a dielectric (such as photo resist). The mold compound and dielectric are patterned after coupling a die to the packaging substrate to expose a contact pad of the packaging substrate. After patterning the mold compound and dielectric, a packaging connection is coupled to contact pads through the mold compound and dielectric. The mold compound surrounding the packaging connection reduces warpage of the packaging substrate during processing. Additionally, patterning the dielectric after attaching the die improves reliability of the packaging connection.

What is claimed is: 
     
         1 . An integrated circuit (IC) packaging method, comprising:
 providing a substrate having a dielectric on a first side of the substrate;   depositing first mold compound on the dielectric;   attaching a die to a second side of the substrate opposite the first side of the substrate;   depositing second mold compound to the second side of the substrate to surround the die; and   depositing a packaging connection on the first side of the substrate that couples to a contact pad of the substrate through the first mold compound and the dielectric.   
     
     
         2 . The method of  claim 1 , further comprising:
 forming an opening in the first mold compound corresponding to the contact pad of the substrate before depositing the packaging connection; and   forming an opening in the dielectric corresponding to the first mold compound opening before depositing the packaging connection.   
     
     
         3 . The method of  claim 2 , wherein the first mold compound opening and the dielectric opening are formed in a single process. 
     
     
         4 . The method of  claim 2 , wherein forming the mold compound opening comprises laser drilling the first mold compound opening and forming the dielectric opening comprises laser drilling the dielectric opening. 
     
     
         5 . The method of  claim 1 , wherein the dielectric comprises a solder resist. 
     
     
         6 . The method of  claim 1 , wherein depositing the packaging connection comprises attaching a ball of a ball grid array to the contact pad through the first mold compound opening and the dielectric opening. 
     
     
         7 . The method of  claim 1 , further comprising depositing an underfill between the die and the substrate. 
     
     
         8 . The method of  claim 1 , wherein the packaging connection is deposited before the second mold compound is deposited, and further comprising backgrinding the first mold compound to expose the packaging connection after attaching the die. 
     
     
         9 . The method of  claim 1 , further comprising integrating the substrate into at least one of a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and a fixed location data unit. 
     
     
         10 . An integrated circuit (IC) packaging method, comprising:
 providing a substrate having a dielectric on a first side of the substrate;   depositing a packaging connection in an opening formed in the dielectric so that the packaging connection couples to a contact pad of the substrate;   depositing first mold compound on the dielectric to surround the packaging connection;   attaching a die to a second side of the substrate opposite the first side of the substrate;   depositing second mold compound to the second side of the substrate to surround the die; and   exposing the package connection through the first mold compound.   
     
     
         11 . The method of  claim 10 , wherein the dielectric comprises a solder resist. 
     
     
         12 . The method of  claim 10 , wherein depositing the packaging connection comprises attaching a ball of a ball grid array to the contact pad through the opening in the dielectric. 
     
     
         13 . The method of  claim 10 , further comprising depositing an underfill between the die and the substrate. 
     
     
         14 . The method of  claim 10 , wherein the packaging connection is deposited before the second mold compound is deposited. 
     
     
         15 . The method of  claim 10 , wherein exposing includes backgrinding the first mold compound to expose the packaging connection after attaching the die to the second side of the substrate. 
     
     
         16 . The method of  claim 10 , further comprising: integrating the substrate into at least one of a mobile phone, a set top box, a music player, a video player, an entertainment unit, a navigation device, a computer, a hand-held personal communication systems (PCS) unit, a portable data unit, and a fixed location data unit. 
     
     
         17 . An integrated circuit (IC) packaging method, comprising:
 depositing first mold compound on a dielectric located on a first side of a substrate;   attaching a die to a second side of the substrate opposite the first side of the substrate;   depositing second mold compound to the second side of the substrate to surround the die; and   depositing a packaging connection on the first side of the substrate that couples to a contact pad of the substrate through the first mold compound and the dielectric.   
     
     
         18 . The method of  claim 17 , further comprising:
 forming an opening in the first mold compound corresponding to the contact pad of the substrate before depositing the packaging connection; and   forming an opening in the dielectric corresponding to the first mold compound opening before depositing the packaging connection.   
     
     
         19 . The method of  claim 18 , wherein the first mold compound opening and the dielectric opening are formed in a single process. 
     
     
         20 . The method of  claim 18 , wherein forming the mold compound opening comprises laser drilling the first mold compound opening and forming the dielectric opening comprises laser drilling the dielectric opening.