Inventor · disambiguated record
Sashidhar Movva
Also filed as: MOVVA SASHIDHAR
2 granted patents·3 pending applications·1 citations·filing 2010–2014
33Inventor score
Top patents by PatentIndex Score
5 records- 0156US8742603B2Process for improving package warpage and connection reliability through use of a backside mold configuration (BSMC)BCHIR OMAR J·Filed 2010·Granted Jun 3, 2014·1 cites·13 claims
- 0247US2015221528A9Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)QUALCOMM INC·Filed 2014·Application pending·0 cites
- 0343US8703602B2Selective seed layer treatment for feature platingBCHIR OMAR J·Filed 2010·Granted Apr 22, 2014·0 cites·11 claims
- 0433US2012090883A1Method and Apparatus for Improving Substrate WarpageBCHIR OMAR J·Filed 2011·Application pending·0 cites
- 0530US2012080787A1Electronic Package and Method of Making an Electronic PackageSHAH MILIND P·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sashidhar Movva files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →