Assignee
BECK SEMICONDUCTOR LLC
US·3 granted patents·1 pending application·19 citations·filing 2006–2009
Technology mixH10W4
Top patents by PatentIndex Score
4 records- 0186US7351655B2Copper interconnect systems which use conductive, metal-based cap layersBECK SEMICONDUCTOR LLC·Filed 2006·Granted Apr 1, 2008·9 cites·16 claims
- 0281US7361589B2Copper interconnect systems which use conductive, metal-based cap layersBECK SEMICONDUCTOR LLC·Filed 2006·Granted Apr 22, 2008·6 cites·17 claims
- 0376US7372152B2Copper interconnect systemsBECK SEMICONDUCTOR LLC·Filed 2006·Granted May 13, 2008·4 cites·23 claims
- 0456US2009321938A1Methods of Manufacturing Copper Interconnect SystemsBECK SEMICONDUCTOR LLC·Filed 2009·Application pending·0 cites
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