Assignee
BRODSKY WILLIAM L
US·4 granted patents·4 pending applications·4 citations·filing 2006–2011
Top patents by PatentIndex Score
8 records- 0171US8589608B2Logic node connection systemBRODSKY WILLIAM L·Filed 2011·Granted Nov 19, 2013·3 cites·14 claims
- 0262US8738828B2System to operationally connect logic nodesBRODSKY WILLIAM L·Filed 2011·Granted May 27, 2014·1 cites·20 claims
- 0348US2010020505A1Printed Circuit Board Assembly Having Multiple Land Grid Arrays for Providing Power DistributionBRODSKY WILLIAM L·Filed 2008·Application pending·0 cites
- 0448US2007226997A1Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention MemberBRODSKY WILLIAM L·Filed 2007·Application pending·0 cites
- 0548US2007227769A1Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention MemberBRODSKY WILLIAM L·Filed 2007·Application pending·0 cites
- 0646US2006199406A1Particle Distribution Interposer and Method of Manufacture ThereofBRODSKY WILLIAM L·Filed 2006·Application pending·0 cites
- 0745US8713228B2Shared system to operationally connect logic nodesBRODSKY WILLIAM L·Filed 2011·Granted Apr 29, 2014·0 cites·20 claims
- 0843US8597032B2Electronic assemblies mating systemBRODSKY WILLIAM L·Filed 2011·Granted Dec 3, 2013·0 cites·15 claims
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