Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention Member

Abstract

A method and apparatus for electrically connecting two substrates using resilient wire bundles captured in apertures of an interposer by a retention film. The interposer comprises an electrically non-conductive carrier having two surfaces and apertures extending from surface to surface. A resilient wire bundle is disposed in each aperture. An electrically non-conductive retention film is associated with one or both surfaces of the carrier and has an orifice overlying each aperture. The width of each orifice is smaller than that of the underlying aperture to thereby enhance retention of the resilient wire bundle within the aperture. Pin contacts of one or both of the substrates make electrical contact with the resilient wire bundles by extending through the orifices of the retention film and partially through the apertures. In one embodiment, the interposer is a land grid array (LGA) connector that connects an electronic module and a printed circuit board (PCB).

1 . An interposer, comprising: 
 an electrically non-conductive carrier having a first surface and a second surface, and an aperture extending from the first surface to the second surface;    an electrically non-conductive first retention member associated with the first surface of the carrier and having an orifice overlying the aperture of the carrier, wherein the orifice of the first retention member has a width smaller than that of the aperture of the carrier;    a resilient wire bundle disposed in the aperture of the carrier.    
   
   
       2 . The interposer as recited in  claim 1 , wherein the first retention member comprises a thin polymer film.  
   
   
       3 . The interposer as recited in  claim 1 , further comprising an electrically non-conductive second retention member associated with to the second surface of the carrier and having an orifice underlying the aperture of the carrier, wherein the orifice of the second retention member has a width smaller than that of the aperture of the carrier.  
   
   
       4 . The interposer as recited in  claim 3 , wherein the first and second retention members each comprises a thin polymer film.  
   
   
       5 . The interposer as recited in  claim 1 , wherein the carrier includes a stop member projecting from the first surface thereof and through a hole in the first retention member.  
   
   
       6 . The interposer as recited in  claim 1 , wherein the carrier includes a plurality of the apertures arranged in an array, wherein the first retention member has a plurality of the orifices, and wherein a plurality of the resilient wire bundles are disposed in the apertures of the carrier.  
   
   
       7 . The interposer as recited in  claim 6 , further comprising an electrically non-conductive second retention member associated with the second surface of the carrier and having a plurality of orifices underlying the apertures of the carrier, wherein the each orifice of the second retention member has a width smaller than that of the overlying aperture of the carrier.  
   
   
       8 . The interposer as recited in  claim 7 , wherein the first and second retention members each comprises a thin polymer film.  
   
   
       9 . The interposer as recited in  claim 8 , wherein the thin polymer film has a thickness of about 0.006 inch.  
   
   
       10 . An interposer, comprising: 
 an electrically non-conductive carrier having a first surface and a second surface, and a plurality of apertures arranged in an array and extending from the first surface to the second surface;    an electrically non-conductive first retention member attached to the first surface of the carrier and having a plurality of orifices overlying the apertures of the carrier, wherein each orifice of the first retention member has a width smaller than that of the underlying aperture of the carrier;    a plurality of resilient wire bundles disposed in the apertures of the carrier.    
   
   
       11 . The interposer as recited in  claim 10 , wherein the first retention member comprises a thin polymer film.  
   
   
       12 . The interposer as recited in  claim 10 , further comprising an electrically non-conductive second retention member attached to the second surface of the carrier and having a plurality of orifices underlying the apertures of the carrier, wherein the each orifice of the second retention member has a width smaller than that of the overlying aperture of the carrier.  
   
   
       13 . The interposer as recited in  claim 12 , wherein the first and second retention members each comprises a thin polymer film.  
   
   
       14 . The interposer as recited in  claim 13 , wherein the thin polymer film has a thickness of about 0.006 inch.  
   
   
       15 . The interposer as recited in  claim 10 , wherein the carrier includes a stop member projecting from the first surface thereof and through a hole in the first retention member.  
   
   
       16 . An interposer, comprising: 
 an electrically non-conductive carrier having a first surface and a second surface, and a plurality of apertures arranged in an array and extending from the first surface to the second surface;    an electrically non-conductive first retention member comprising a thin polymer film attached to the first surface of the carrier and having a plurality of orifices overlying the apertures of the carrier, wherein each orifice of the first retention member has a width smaller than that of the underlying aperture of the carrier;    a plurality of resilient wire bundles disposed in the apertures of the carrier.    
   
   
       17 . The interposer as recited in  claim 16 , further comprising an electrically non-conductive second retention member comprising a thin polymer film attached to the second surface of the carrier and having a plurality of orifices underlying the apertures of the carrier, wherein the each orifice of the second retention member has a width smaller than that of the overlying aperture of the carrier.