Inventor · disambiguated record
Roger Duane Hamilton
Also filed as: HAMILTON ROGER D · HAMILTON ROGER DUANE
27 granted patents·2 pending applications·733 citations·filing 1995–2018
97Inventor score
Top patents by PatentIndex Score
29 records- 0195US7486516B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2005·Granted Feb 3, 2009·32 cites·2 claims
- 0293US6385044B1Heat pipe heat sink assembly for cooling semiconductor chipsIBM·Filed 2001·Granted May 7, 2002·88 cites·18 claims
- 0392US7606033B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted Oct 20, 2009·18 cites·20 claims
- 0491US7777329B2Heatsink apparatus for applying a specified compressive force to an integrated circuit deviceIBM·Filed 2006·Granted Aug 17, 2010·24 cites·9 claims
- 0590US7293994B2Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention memberIBM·Filed 2005·Granted Nov 13, 2007·15 cites·13 claims
- 0690US6475011B1Land grid array socket actuation hardware for MCM applicationsIBM·Filed 2001·Granted Nov 5, 2002·52 cites·14 claims
- 0789US10779391B2Integrated circuit device assemblyIBM·Filed 2018·Granted Sep 15, 2020·6 cites·16 claims
- 0889US5870286AHeat sink assembly for cooling electronic modulesIBM·Filed 1997·Granted Feb 9, 1999·92 cites·8 claims
- 0988US5940266ABi-directional cooling arrangement for use with an electronic component enclosureIBM·Filed 1997·Granted Aug 17, 1999·76 cites·11 claims
- 1087US6449155B1Land grid array subassembly for multichip modulesIBM·Filed 2001·Granted Sep 10, 2002·48 cites·14 claims
- 1186US7345881B2Non-influencing fastener for mounting a heat sink in contact with an electronic componentIBM·Filed 2006·Granted Mar 18, 2008·15 cites·18 claims
- 1286US5978223ADual heat sink assembly for cooling multiple electronic modulesIBM·Filed 1998·Granted Nov 2, 1999·87 cites·13 claims
- 1384US7944698B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted May 17, 2011·9 cites·20 claims
- 1483US6061240APush pin assembly for heat sink for cooling electronic modulesIBM·Filed 1998·Granted May 9, 2000·61 cites·3 claims
- 1581US9913361B2Integrated circuit device assemblyIBM·Filed 2016·Granted Mar 6, 2018·3 cites·17 claims
- 1679US8363404B2Implementing loading and heat removal for hub module assemblyIBM·Filed 2010·Granted Jan 29, 2013·5 cites·20 claims
- 1778US6634095B2Apparatus for mounting a land grid array moduleIBM·Filed 2001·Granted Oct 21, 2003·19 cites·13 claims
- 1876US7765693B2Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention memberIBM·Filed 2008·Granted Aug 3, 2010·5 cites·14 claims
- 1974US6757965B2Method of installing a land grid array multi-chip modulesIBM·Filed 2003·Granted Jul 6, 2004·15 cites·5 claims
- 2068US9265157B2Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprintIBM·Filed 2013·Granted Feb 16, 2016·2 cites·14 claims
- 2163US6988533B2Method and apparatus for mounting a heat transfer apparatus upon an electronic componentIBM·Filed 2003·Granted Jan 24, 2006·11 cites·13 claims
- 2262US5617296APrinted circuit board covers for an electronics packageIBM·Filed 1995·Granted Apr 1, 1997·23 cites·17 claims
- 2360US10109975B2Module placement apparatusIBM·Filed 2015·Granted Oct 23, 2018·1 cites·9 claims
- 2460US6802733B2Topside installation apparatus for land grid array modulesIBM·Filed 2001·Granted Oct 12, 2004·8 cites·15 claims
- 2553US6792375B2Apparatus, system, and method of determining loading characteristics on an integrated circuit moduleIBM·Filed 2002·Granted Sep 14, 2004·5 cites·22 claims
- 2648US7071720B2Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unitIBM·Filed 2004·Granted Jul 4, 2006·2 cites·10 claims
- 2748US2007226997A1Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention MemberBRODSKY WILLIAM L·Filed 2007·Application pending·0 cites
- 2848US2007227769A1Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention MemberBRODSKY WILLIAM L·Filed 2007·Application pending·0 cites
- 2944US5929377AApparatus for preventing leakage of electromagnetic radiation from electronic enclosuresIBM·Filed 1997·Granted Jul 27, 1999·11 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →