Inventor · disambiguated record
John L. Colbert
Also filed as: COLBERT JOHN L · COLBERT JOHN LEE
42 granted patents·5 pending applications·738 citations·filing 1997–2015
98Inventor score
Top patents by PatentIndex Score
47 records- 0195US7499279B2Cold plate stabilityIBM·Filed 2007·Granted Mar 3, 2009·30 cites·11 claims
- 0295US7486516B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2005·Granted Feb 3, 2009·32 cites·2 claims
- 0394US8267701B2Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housingBEAMAN BRIAN S·Filed 2010·Granted Sep 18, 2012·23 cites·25 claims
- 0494US6480391B1Modular cage for an electronic componentIBM·Filed 2000·Granted Nov 12, 2002·101 cites·35 claims
- 0593US7342306B2High performance reworkable heatsink and packaging structure with solder release layerIBM·Filed 2005·Granted Mar 11, 2008·22 cites·10 claims
- 0693US6385044B1Heat pipe heat sink assembly for cooling semiconductor chipsIBM·Filed 2001·Granted May 7, 2002·88 cites·18 claims
- 0792US7606033B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted Oct 20, 2009·18 cites·20 claims
- 0891US7777329B2Heatsink apparatus for applying a specified compressive force to an integrated circuit deviceIBM·Filed 2006·Granted Aug 17, 2010·24 cites·9 claims
- 0991US7751918B2Methods for configuring tubing for interconnecting in-series multiple liquid-cooled cold platesIBM·Filed 2007·Granted Jul 6, 2010·26 cites·20 claims
- 1091US7435622B2High performance reworkable heatsink and packaging structure with solder release layer and method of makingIBM·Filed 2007·Granted Oct 14, 2008·19 cites·7 claims
- 1190US7293994B2Method and apparatus for electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention memberIBM·Filed 2005·Granted Nov 13, 2007·15 cites·13 claims
- 1290US6475011B1Land grid array socket actuation hardware for MCM applicationsIBM·Filed 2001·Granted Nov 5, 2002·52 cites·14 claims
- 1387US7903411B2Cold plate stabilityIBM·Filed 2008·Granted Mar 8, 2011·12 cites·10 claims
- 1487US6449155B1Land grid array subassembly for multichip modulesIBM·Filed 2001·Granted Sep 10, 2002·48 cites·14 claims
- 1586US7345881B2Non-influencing fastener for mounting a heat sink in contact with an electronic componentIBM·Filed 2006·Granted Mar 18, 2008·15 cites·18 claims
- 1684US7944698B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted May 17, 2011·9 cites·20 claims
- 1779US8363404B2Implementing loading and heat removal for hub module assemblyIBM·Filed 2010·Granted Jan 29, 2013·5 cites·20 claims
- 1878US6634095B2Apparatus for mounting a land grid array moduleIBM·Filed 2001·Granted Oct 21, 2003·19 cites·13 claims
- 1977US7517230B2Customizable backer for achieving consistent loading and engagement of array package connectionsIBM·Filed 2008·Granted Apr 14, 2009·6 cites·9 claims
- 2076US7765693B2Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention memberIBM·Filed 2008·Granted Aug 3, 2010·5 cites·14 claims
- 2176US7399185B2Customizable backer for achieving consistent loading and engagement of array package connectionsIBM·Filed 2006·Granted Jul 15, 2008·6 cites·8 claims
- 2274US6757965B2Method of installing a land grid array multi-chip modulesIBM·Filed 2003·Granted Jul 6, 2004·15 cites·5 claims
- 2371US8680670B2Multi-chip module system with removable socketed modulesCASEY JON ALFRED·Filed 2010·Granted Mar 25, 2014·4 cites·16 claims
- 2469US7701720B2Electronic assembly and techniques for installing a heatsink in an electronic assemblyIBM·Filed 2007·Granted Apr 20, 2010·4 cites·6 claims
- 2568US9265157B2Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprintIBM·Filed 2013·Granted Feb 16, 2016·2 cites·14 claims
- 2668US6561554B2Simplified latch and associated assembly methodIBM·Filed 2001·Granted May 13, 2003·14 cites·25 claims
- 2767US8446738B2Motherboard assembly for interconnecting and distributing signals and powerCOLBERT JOHN L·Filed 2009·Granted May 21, 2013·3 cites·14 claims
- 2865US8958214B2Motherboard assembly for interconnecting and distributing signals and powerCOLBERT JOHN L·Filed 2012·Granted Feb 17, 2015·1 cites·10 claims
- 2963US6988533B2Method and apparatus for mounting a heat transfer apparatus upon an electronic componentIBM·Filed 2003·Granted Jan 24, 2006·11 cites·13 claims
- 3063US5947570AModular cabinet assembly for a computerIBM·Filed 1997·Granted Sep 7, 1999·50 cites·26 claims
- 3161US7731146B2Dual swivel in-line load node lock mechanismIBM·Filed 2008·Granted Jun 8, 2010·3 cites·1 claims
- 3261US5928016ADirect access storage device housing and tray designIBM·Filed 1997·Granted Jul 27, 1999·26 cites·20 claims
- 3360US6802733B2Topside installation apparatus for land grid array modulesIBM·Filed 2001·Granted Oct 12, 2004·8 cites·15 claims
- 3455US7985095B2Implementing enhanced connector guide block structures for robust SMT assemblyIBM·Filed 2009·Granted Jul 26, 2011·0 cites·20 claims
- 3554US9456506B2Packaging for eight-socket one-hop SMP topologyIBM·Filed 2013·Granted Sep 27, 2016·0 cites·13 claims
- 3653US7339266B2Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereofIBM·Filed 2004·Granted Mar 4, 2008·4 cites·11 claims
- 3753US6792375B2Apparatus, system, and method of determining loading characteristics on an integrated circuit moduleIBM·Filed 2002·Granted Sep 14, 2004·5 cites·22 claims
- 3852US7550840B2Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereofIBM·Filed 2007·Granted Jun 23, 2009·0 cites·11 claims
- 3949US9445507B2Packaging for eight-socket one-hop SMP topologyIBM·Filed 2015·Granted Sep 13, 2016·0 cites·7 claims
- 4049US2011320237A1Meeting Calendar OptimizationBEAMAN BRIAN S·Filed 2010·Application pending·0 cites
- 4148US7071720B2Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unitIBM·Filed 2004·Granted Jul 4, 2006·2 cites·10 claims
- 4248US2007226997A1Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention MemberBRODSKY WILLIAM L·Filed 2007·Application pending·0 cites
- 4348US2007227769A1Method and Apparatus for Electrically Connecting Two Substrates Using a Resilient Wire Bundle Captured in an Aperture of an Interposer by a Retention MemberBRODSKY WILLIAM L·Filed 2007·Application pending·0 cites
- 4444US6089917AMethod and system for circuit board common mode noise suppression utilizing ferrous coresIBM·Filed 1997·Granted Jul 18, 2000·11 cites·6 claims
- 4544US2009034198A1Apparatus and method for attaching heatsinksIBM·Filed 2007·Application pending·0 cites
- 4640US8747122B2Implementing connection of two large electronic boards utilizing LGA interconnectBANITT TERRY F·Filed 2010·Granted Jun 10, 2014·0 cites·20 claims
- 4740US2008044576A1Method and Apparatus for Applying Thermal Interface MaterialCOLBERT JOHN L·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when John L. Colbert files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →