Assignee
BRUNNBAUER MARKUS
DE·11 granted patents·1 pending application·89 citations·filing 2007–2012
Top patents by PatentIndex Score
12 records- 0195US8330273B2Semiconductor device including molding compound layer forms a common plane with the surface of the semiconductor chipBRUNNBAUER MARKUS·Filed 2010·Granted Dec 11, 2012·25 cites·23 claims
- 0290US8106497B2Semiconductor module having a semiconductor chip stack and methodBRUNNBAUER MARKUS·Filed 2007·Granted Jan 31, 2012·25 cites·17 claims
- 0387US8188585B2Electronic device and method for producing a deviceBRUNNBAUER MARKUS·Filed 2007·Granted May 29, 2012·10 cites·28 claims
- 0485US8309454B2Structure for electrostatic discharge in embedded wafer level packagesBRUNNBAUER MARKUS·Filed 2007·Granted Nov 13, 2012·10 cites·14 claims
- 0581US8076784B2Stacked semiconductor chipsBRUNNBAUER MARKUS·Filed 2010·Granted Dec 13, 2011·5 cites·18 claims
- 0679US8080880B2Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact padsBRUNNBAUER MARKUS·Filed 2009·Granted Dec 20, 2011·8 cites·13 claims
- 0772US8158046B2Mold apparatus and methodBRUNNBAUER MARKUS·Filed 2007·Granted Apr 17, 2012·4 cites·11 claims
- 0864US8247897B2Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the sameBRUNNBAUER MARKUS·Filed 2007·Granted Aug 21, 2012·2 cites·9 claims
- 0951US8394308B2Mold methodBRUNNBAUER MARKUS·Filed 2012·Granted Mar 12, 2013·0 cites·7 claims
- 1050US8524542B2Blank including a composite panel with semiconductor chips and plastic package molding compound and method and mold for producing the sameBRUNNBAUER MARKUS·Filed 2012·Granted Sep 3, 2013·0 cites·15 claims
- 1149US8587110B2Semiconductor module having a semiconductor chip stack and methodBRUNNBAUER MARKUS·Filed 2011·Granted Nov 19, 2013·0 cites·15 claims
- 1249US2012235298A1Electronic device and method for producing a deviceBRUNNBAUER MARKUS·Filed 2012·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →