Electronic device and method for producing a device

Abstract

An electronic device or devices and method for producing a device is disclosed. One embodiment provides an integrated component, a first package body and a contact device. The contact device penetrates the package body.

1 . An electronic device, comprising:
 an integrated component;   a package body;   at least one contact device; and   the contact device penetrating the package body.   
     
     
         2 . The device of  claim 1 , comprising:
 the contact device at a first end terminating with the package body or protruding beyond the package body; and   the contact device at a second end terminating with the package body or protruding beyond the package body.   
     
     
         3 . The device of  claim 1 , comprising wherein a surface of the contact device consists of a metal containing more than 50 atomic percent. 
     
     
         4 . The device of  claim 1 , comprising wherein the contact device penetrates the package body from a first side of the package body to a second side of the package body facing away from the first side. 
     
     
         5 . The device of  claim 1 , comprising wherein the contact device is arranged to the side of the integrated component. 
     
     
         6 . The device of  claim 1 , comprising a wiring arrangement, which overlaps the integrated component, the package body and the contact device. 
     
     
         7 . The device of  claim 6 , comprising wherein the wiring arrangement connects the contact device to the integrated component in an electrically conductive manner. 
     
     
         8 . The device of  claim 6 , comprising wherein the integrated circuit, the package body and the contact device are arranged on the same side of the wiring arrangement. 
     
     
         9 . The device of  claim 1 , comprising wherein the contact devices are balls or balls that are deformed on one side or balls that are deformed on two sides. 
     
     
         10 . The device of  claim 1 , comprising wherein the contact devices consist of solder material. 
     
     
         11 . The device of  claim 1 , comprising wherein a number of contact devices are arranged in a first plane, and the side faces of the contact devices have a straight line of intersection or a curved line of intersection with a second plane, which extends in a direction normal to the first plane. 
     
     
         12 . The device of  claim 1 , comprising wherein the contact device is adjacent the package body. 
     
     
         13 . The device of  claim 1 , comprising wherein the package body consists of an epoxy material or contains an epoxy material. 
     
     
         14 . The device of  claim 1 , comprising wherein the package body consists of a plastic. 
     
     
         15 . The device of  claim 1 , comprising wherein the wiring arrangement has a layer thickness of less than 50 micrometers, the wiring arrangement being a wiring arrangement produced by thin-film technology, which has only one or more metallization layer. 
     
     
         16 . The device of  claim 1 , comprising wherein a lateral dimension of the first packaged component is less than 30 mm. 
     
     
         17 . A device stack, comprising at least two devices of  claim 1 .