Inventor · disambiguated record
Thorsten Meyer
Also filed as: LEHMANN LEGAL REPRESENTATIVE JUDITH · MEYER THORSTEN
225 granted patents·73 pending applications·2,586 citations·filing 1995–2025
99Inventor score
Files withINFINEON TECHNOLOGIES AG110MEYER THORSTEN44INTEL CORP26INTEL IP CORP18INTEL MOBILE COMM GMBH11
Top patents by PatentIndex Score
298 records- 0198US10211182B2Package-on-package stacked microelectronic structuresINTEL IP CORP·Filed 2014·Granted Feb 19, 2019·47 cites·25 claims
- 0298US10043768B2Semiconductor device and method of manufacture thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 7, 2018·46 cites·17 claims
- 0398US8878360B2Stacked fan-out semiconductor chipMEYER THORSTEN·Filed 2012·Granted Nov 4, 2014·71 cites·10 claims
- 0498US8729714B1Flip-chip wafer level package and methods thereofMEYER THORSTEN·Filed 2012·Granted May 20, 2014·72 cites·8 claims
- 0598US7834464B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 16, 2010·87 cites·10 claims
- 0698US7208345B2Method of manufacturing a semiconductor device comprising stacked chips and a corresponding semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 24, 2007·101 cites·7 claims
- 0797US9997444B2Microelectronic package having a passive microelectronic device disposed within a package bodyINTEL CORP·Filed 2014·Granted Jun 12, 2018·41 cites·24 claims
- 0897US9663353B2Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)INTEL IP CORP·Filed 2013·Granted May 30, 2017·29 cites·16 claims
- 0997US9646856B2Method of manufacturing a semiconductor device including removing a relief layer from back surface of semiconductor chipINTEL MOBILE COMM GMBH·Filed 2015·Granted May 9, 2017·75 cites·12 claims
- 1097US9312198B2Chip package-in-package and method thereofINTEL MOBILE COMM GMBH·Filed 2013·Granted Apr 12, 2016·39 cites·11 claims
- 1197US8183696B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2010·Granted May 22, 2012·47 cites·20 claims
- 1297US6727576B2Transfer wafer level packagingINFINEON TECHNOLOGIES AG·Filed 2001·Granted Apr 27, 2004·168 cites·16 claims
- 1396US9543224B1Hybrid exposure for semiconductor devicesINTEL IP CORP·Filed 2015·Granted Jan 10, 2017·19 cites·25 claims
- 1496US9385105B2Semiconductor devicesINTEL DEUTSCHLAND GMBH·Filed 2013·Granted Jul 5, 2016·52 cites·8 claims
- 1596US9373700B2Field plate trench transistor and method for producing itINFINEON TECHNOLOGIES AUSTRIA·Filed 2015·Granted Jun 21, 2016·9 cites·20 claims
- 1696US8716859B2Enhanced flip chip packageMEYER THORSTEN·Filed 2012·Granted May 6, 2014·22 cites·13 claims
- 1796US8451618B2Integrated antennas in wafer level packageBOECK JOSEF·Filed 2010·Granted May 28, 2013·43 cites·12 claims
- 1896US8202763B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceMEYER THORSTEN·Filed 2010·Granted Jun 19, 2012·26 cites·16 claims
- 1995US9985005B2Chip package-in-packageINTEL DEUTSCHLAND GMBH·Filed 2016·Granted May 29, 2018·14 cites·14 claims
- 2095US9064883B2Chip with encapsulated sides and exposed surfaceMEYER THORSTEN·Filed 2011·Granted Jun 23, 2015·41 cites·7 claims
- 2195US8258633B2Semiconductor package and multichip arrangement having a polymer layer and an encapsulantSEZI RECAI·Filed 2010·Granted Sep 4, 2012·43 cites·19 claims
- 2295US8012807B2Method for producing chip packages, and chip package produced in this wayINFINEON TECHNOLOGIES AG·Filed 2007·Granted Sep 6, 2011·23 cites·21 claims
- 2395US7906860B2Semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 15, 2011·53 cites·18 claims
- 2495US7759163B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 20, 2010·49 cites·17 claims
- 2595US7307328B2Semiconductor device with temperature sensorINFINEON TECHNOLOGIES AG·Filed 2005·Granted Dec 11, 2007·42 cites·7 claims
- 2695US6936928B2Semiconductor component and method for its productionINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 30, 2005·107 cites·16 claims
- 2795US6845554B2Method for connection of circuit unitsINFINEON TECHNOLOGIES AG·Filed 2002·Granted Jan 25, 2005·114 cites·7 claims
- 2894US12158448B2Radiation source deviceINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 3, 2024·2 cites·20 claims
- 2994US10170409B2Package on package architecture and method for makingGANESAN SANKA·Filed 2013·Granted Jan 1, 2019·22 cites·20 claims
- 3094US8829663B2Stackable semiconductor package with encapsulant and electrically conductive feed-throughPOHL JENS·Filed 2007·Granted Sep 9, 2014·36 cites·21 claims
- 3194US7943423B2Reconfigured wafer alignmentINFINEON TECHNOLOGIES AG·Filed 2009·Granted May 17, 2011·28 cites·24 claims
- 3294US6714418B2Method for producing an electronic component having a plurality of chips that are stacked one above the other and contact-connected to one anotherINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 30, 2004·89 cites·26 claims
- 3393US10319688B2Antenna on ceramics for a packaged dieINTEL CORP·Filed 2013·Granted Jun 11, 2019·21 cites·18 claims
- 3493US9293423B2Workpiece with semiconductor chips, semiconductor device and method for producing a workpiece with semiconductor chipsINTEL MOBILE COMM GMBH·Filed 2014·Granted Mar 22, 2016·11 cites·15 claims
- 3593US8741690B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2012·Granted Jun 3, 2014·16 cites·25 claims
- 3693US8178953B2On-chip RF shields with front side redistribution linesBARTH HANS-JOACHIM·Filed 2008·Granted May 15, 2012·22 cites·25 claims
- 3793US7687895B2Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chipsINFINEON TECHNOLOGIES AG·Filed 2007·Granted Mar 30, 2010·30 cites·41 claims
- 3891US8779564B1Semiconductor device with capacitive coupling structureINTEL IP CORP·Filed 2013·Granted Jul 15, 2014·14 cites·26 claims
- 3991US8003515B2Device and manufacturing methodINFINEON TECHNOLOGIES AG·Filed 2009·Granted Aug 23, 2011·35 cites·22 claims
- 4091US7893486B2Field plate trench transistor and method for producing itINFINEON TECHNOLOGIES AUSTRIA·Filed 2009·Granted Feb 22, 2011·12 cites·7 claims
- 4190US8334564B2Field plate trench transistor and method for producing itHIRLER FRANZ·Filed 2011·Granted Dec 18, 2012·8 cites·7 claims
- 4290US8093711B2Semiconductor deviceZUDOCK FRANK·Filed 2009·Granted Jan 10, 2012·32 cites·22 claims
- 4390US7732242B2Composite board with semiconductor chips and plastic housing composition and methodINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 8, 2010·22 cites·6 claims
- 4490US7339237B2Connection, configuration, and production of a buried semiconductor layerINFINEON TECHNOLOGIES AG·Filed 2005·Granted Mar 4, 2008·19 cites·26 claims
- 4589US10629575B1Stacked die semiconductor package with electrical interposerINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 21, 2020·6 cites·20 claims
- 4689US10394280B2Wearable electronic devices and components thereofINTEL CORP·Filed 2018·Granted Aug 27, 2019·6 cites·6 claims
- 4789US9711492B2Three dimensional structures within mold compoundINTEL CORP·Filed 2014·Granted Jul 18, 2017·8 cites·20 claims
- 4889US8659154B2Semiconductor device including adhesive covered elementMEYER THORSTEN·Filed 2008·Granted Feb 25, 2014·10 cites·25 claims
- 4988US10903166B2Integrated circuit packagesGANESAN SANKA·Filed 2016·Granted Jan 26, 2021·5 cites·25 claims
- 5088US10249598B2Integrated circuit package having wirebonded multi-die stackINTEL CORP·Filed 2018·Granted Apr 2, 2019·4 cites·10 claims
Showing the top 50 of 298 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →