Assignee
MEYER THORSTEN
DE32 patents
Top patents by PatentIndex Score
US8878360B2Nov 4, 2014
Stacked fan-out semiconductor chip
MEYER THORSTEN71 citations98
US8729714B1May 20, 2014
Flip-chip wafer level package and methods thereof
MEYER THORSTEN72 citations98
US8183696B2May 22, 2012
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
MEYER THORSTEN47 citations97
US9064883B2Jun 23, 2015
Chip with encapsulated sides and exposed surface
MEYER THORSTEN41 citations93
US8202763B2Jun 19, 2012
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
MEYER THORSTEN26 citations93
US8741690B2Jun 3, 2014
Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
MEYER THORSTEN16 citations92
US8716859B2May 6, 2014
Enhanced flip chip package
MEYER THORSTEN22 citations92
US8754522B2Jun 17, 2014
Repairable semiconductor device and method
MEYER THORSTEN8 citations84
US8659154B2Feb 25, 2014
Semiconductor device including adhesive covered element
MEYER THORSTEN10 citations84
US8471393B2Jun 25, 2013
Semiconductor component including a semiconductor chip and a passive component
MEYER THORSTEN8 citations84
US8421226B2Apr 16, 2013
Device including an encapsulated semiconductor chip and manufacturing method thereof
MEYER THORSTEN10 citations84
US8390107B2Mar 5, 2013
Semiconductor device and methods of manufacturing semiconductor devices
MEYER THORSTEN12 citations84
US8786105B1Jul 22, 2014
Semiconductor device with chip having low-k-layers
MEYER THORSTEN5 citations72
US8742563B2Jun 3, 2014
Component and method for producing a component
MEYER THORSTEN2 citations63
US8461691B2Jun 11, 2013
Chip-packaging module for a chip and a method for forming a chip-packaging module
MEYER THORSTEN2 citations63
US8217504B2Jul 10, 2012
Article and panel comprising semiconductor chips, casting mold and methods of producing the same
MEYER THORSTEN4 citations63
US8076180B2Dec 13, 2011
Repairable semiconductor device and method
MEYER THORSTEN4 citations63
US8643068B2Feb 4, 2014
Integrated circuit having field effect transistors and manufacturing method
MEYER THORSTEN2 citations62
US8178965B2May 15, 2012
Semiconductor module having deflecting conductive layer over a spacer structure
MEYER THORSTEN2 citations61
US9455161B2Sep 27, 2016
Semiconductor device and methods of manufacturing semiconductor devices
MEYER THORSTEN0 citations52
US9362144B2Jun 7, 2016
Article and panel comprising semiconductor chips, casting mold and methods of producing the same
MEYER THORSTEN0 citations52
US9164404B2Oct 20, 2015
System and process for fabricating semiconductor packages
MEYER THORSTEN1 citations52
US9093322B2Jul 28, 2015
Semiconductor device
MEYER THORSTEN1 citations52
US9030019B2May 12, 2015
Semiconductor device and method of manufacture thereof
MEYER THORSTEN1 citations52
US8941206B2Jan 27, 2015
Semiconductor device including a diode and method of manufacturing a semiconductor device
MEYER THORSTEN0 citations52
US8878335B2Nov 4, 2014
Method and system for providing fusing after packaging of semiconductor devices
MEYER THORSTEN0 citations52
US8604622B2Dec 10, 2013
Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device
MEYER THORSTEN0 citations52
US8598709B2Dec 3, 2013
Method and system for routing electrical connections of semiconductor chips
MEYER THORSTEN1 citations52
US8487448B2Jul 16, 2013
Method for producing chip packages, and chip package produced in this way
MEYER THORSTEN0 citations52
US9219034B2Dec 22, 2015
Semiconductor module having deflecting conductive layer over a spacer structure
MEYER THORSTEN0 citations51
US9331057B2May 3, 2016
Semiconductor device
MEYER THORSTEN1 citations50
US8637954B2Jan 28, 2014
Integrated circuit technology with different device epitaxial layers
MEYER THORSTEN0 citations42