Assignee
MEYER THORSTEN
DE·32 granted patents·12 pending applications·369 citations·filing 2005–2014
Top patents by PatentIndex Score
44 records- 0198US8878360B2Stacked fan-out semiconductor chipMEYER THORSTEN·Filed 2012·Granted Nov 4, 2014·71 cites·10 claims
- 0298US8729714B1Flip-chip wafer level package and methods thereofMEYER THORSTEN·Filed 2012·Granted May 20, 2014·72 cites·8 claims
- 0397US8183696B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2010·Granted May 22, 2012·47 cites·20 claims
- 0496US8716859B2Enhanced flip chip packageMEYER THORSTEN·Filed 2012·Granted May 6, 2014·22 cites·13 claims
- 0596US8202763B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceMEYER THORSTEN·Filed 2010·Granted Jun 19, 2012·26 cites·16 claims
- 0695US9064883B2Chip with encapsulated sides and exposed surfaceMEYER THORSTEN·Filed 2011·Granted Jun 23, 2015·41 cites·7 claims
- 0793US8741690B2Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact padsMEYER THORSTEN·Filed 2012·Granted Jun 3, 2014·16 cites·25 claims
- 0889US8659154B2Semiconductor device including adhesive covered elementMEYER THORSTEN·Filed 2008·Granted Feb 25, 2014·10 cites·25 claims
- 0988US8421226B2Device including an encapsulated semiconductor chip and manufacturing method thereofMEYER THORSTEN·Filed 2010·Granted Apr 16, 2013·10 cites·24 claims
- 1087US8754522B2Repairable semiconductor device and methodMEYER THORSTEN·Filed 2011·Granted Jun 17, 2014·8 cites·20 claims
- 1187US8390107B2Semiconductor device and methods of manufacturing semiconductor devicesMEYER THORSTEN·Filed 2007·Granted Mar 5, 2013·12 cites·12 claims
- 1279US8786105B1Semiconductor device with chip having low-k-layersMEYER THORSTEN·Filed 2013·Granted Jul 22, 2014·5 cites·30 claims
- 1377US8471393B2Semiconductor component including a semiconductor chip and a passive componentMEYER THORSTEN·Filed 2006·Granted Jun 25, 2013·8 cites·20 claims
- 1472US8217504B2Article and panel comprising semiconductor chips, casting mold and methods of producing the sameMEYER THORSTEN·Filed 2008·Granted Jul 10, 2012·4 cites·10 claims
- 1572US8076180B2Repairable semiconductor device and methodMEYER THORSTEN·Filed 2008·Granted Dec 13, 2011·4 cites·16 claims
- 1670US8643068B2Integrated circuit having field effect transistors and manufacturing methodMEYER THORSTEN·Filed 2009·Granted Feb 4, 2014·2 cites·21 claims
- 1768US8742563B2Component and method for producing a componentMEYER THORSTEN·Filed 2010·Granted Jun 3, 2014·2 cites·16 claims
- 1868US8461691B2Chip-packaging module for a chip and a method for forming a chip-packaging moduleMEYER THORSTEN·Filed 2011·Granted Jun 11, 2013·2 cites·23 claims
- 1964US9164404B2System and process for fabricating semiconductor packagesMEYER THORSTEN·Filed 2008·Granted Oct 20, 2015·1 cites·23 claims
- 2063US9030019B2Semiconductor device and method of manufacture thereofMEYER THORSTEN·Filed 2010·Granted May 12, 2015·1 cites·21 claims
- 2162US8178965B2Semiconductor module having deflecting conductive layer over a spacer structureMEYER THORSTEN·Filed 2007·Granted May 15, 2012·2 cites·33 claims
- 2261US8598709B2Method and system for routing electrical connections of semiconductor chipsMEYER THORSTEN·Filed 2010·Granted Dec 3, 2013·1 cites·24 claims
- 2356US9331057B2Semiconductor deviceMEYER THORSTEN·Filed 2007·Granted May 3, 2016·1 cites·18 claims
- 2455US9455161B2Semiconductor device and methods of manufacturing semiconductor devicesMEYER THORSTEN·Filed 2013·Granted Sep 27, 2016·0 cites·9 claims
- 2554US9093322B2Semiconductor deviceMEYER THORSTEN·Filed 2007·Granted Jul 28, 2015·1 cites·17 claims
- 2653US8604622B2Semiconductor chip package, semiconductor chip assembly, and method for fabricating a deviceMEYER THORSTEN·Filed 2012·Granted Dec 10, 2013·0 cites·9 claims
- 2753US2014357075A1Semiconductor deviceMEYER THORSTEN·Filed 2014·Application pending·0 cites
- 2852US9362144B2Article and panel comprising semiconductor chips, casting mold and methods of producing the sameMEYER THORSTEN·Filed 2012·Granted Jun 7, 2016·0 cites·8 claims
- 2952US2014206142A1Flip-chip wafer level package and methods thereofMEYER THORSTEN·Filed 2014·Application pending·0 cites
- 3050US8487448B2Method for producing chip packages, and chip package produced in this wayMEYER THORSTEN·Filed 2011·Granted Jul 16, 2013·0 cites·9 claims
- 3150US2014264831A1Chip arrangement and a method for manufacturing a chip arrangementMEYER THORSTEN·Filed 2013·Application pending·0 cites
- 3248US9219034B2Semiconductor module having deflecting conductive layer over a spacer structureMEYER THORSTEN·Filed 2012·Granted Dec 22, 2015·0 cites·29 claims
- 3348US8941206B2Semiconductor device including a diode and method of manufacturing a semiconductor deviceMEYER THORSTEN·Filed 2012·Granted Jan 27, 2015·0 cites·25 claims
- 3448US2014159856A1Sensor hierarchyMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 3548US2011291274A1Method of manufacturing a semiconductor deviceMEYER THORSTEN·Filed 2011·Application pending·0 cites
- 3647US8878335B2Method and system for providing fusing after packaging of semiconductor devicesMEYER THORSTEN·Filed 2010·Granted Nov 4, 2014·0 cites·5 claims
- 3745US2013237357A1Duplex toothed chain and arrangement comprising such a toothed chain and an external toothing of a toothed chain engagement deviceMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 3843US2008224837A1Method and Warning Device for Graphically Processing an Image of a CameraMEYER THORSTEN·Filed 2005·Application pending·0 cites
- 3942US2014151700A1Chip package and a method for manufacturing a chip packageMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 4041US8637954B2Integrated circuit technology with different device epitaxial layersMEYER THORSTEN·Filed 2010·Granted Jan 28, 2014·0 cites·17 claims
- 4141US2013328191A1Cte adaption in a semiconductor packageMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 4241US2013342263A1Heater for semiconductor deviceMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 4341US2013256884A1Grid fan-out wafer level package and methods of manufacturing a grid fan-out wafer level packageMEYER THORSTEN·Filed 2012·Application pending·0 cites
- 4440US2013256883A1Rotated semiconductor device fan-out wafer level packages and methods of manufacturing rotated semiconductor device fan-out wafer level packagesMEYER THORSTEN·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →