Flip-chip wafer level package and methods thereof

Abstract

An electronic package includes a flip-chip component having a first die coupled to a flip-chip substrate, second die stacked on the first die, an encapsulation compound formed around the first die and the second die, a set of through encapsulant vias (TEVs) providing a set of electrical connections from a first side of the electronic package to a second side of the electronic package through the encapsulation compound to the flip-chip substrate, and a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package.

What is claimed is: 
     
         1 . A method for manufacturing an electronic package, the method comprising:
 providing a flip-chip component having a first die coupled to a flip-chip substrate;   adhering the first die to a second die;   forming an encapsulation compound around the first die and the second die;   drilling a set of through encapsulant vias (TEVs) from a first side of the electronic package to the flip-chip substrate located on a second side of the electronic package;   filling the set of TEVs with an electrically conductive material; and   applying a redistribution layer electrically connecting a set of contacts on the second die to the set of TEVs on the first side of the electronic package.   
     
     
         2 . The method of  claim 1  further comprising applying a protection layer covering the redistribution layer and the TEVs. 
     
     
         3 . The method of  claim 1  further comprising adhering solder balls to the flip-chip substrate. 
     
     
         4 . The method of  claim 1  further comprising separately testing and burning-in the flip-chip component. 
     
     
         5 . The method of  claim 1  further comprising:
 adhering the second die to a mold carrier with a releasable adhesive; and 
 removing the mold carrier from the second die. 
 
     
     
         6 . The method of  claim 1  further comprising:
 adhering the flip-chip component to a mold carrier with a releasable adhesive; and 
 removing the mold carrier from the flip-chip component. 
 
     
     
         7 . The method of  claim 6  further comprising coupling a set of posts onto the set of contacts on the second die. 
     
     
         8 . The method of  claim 5  wherein the posts comprise copper. 
     
     
         9 . The method of  claim 6  further comprising:
 forming the encapsulation compound over the second die; and 
 exposing the posts. 
 
     
     
         10 . The method of  claim 9  wherein exposing the posts comprises grinding the encapsulation compound until the posts are exposed, the encapsulation compound forming a substantially planer surface. 
     
     
         11 . The method of  claim 9  wherein exposing the posts comprises laser drilling the encapsulation compound.