Component and method for producing a component

Abstract

A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing body, and one or more external contact devices in communication with the wiring device.

We claim: 
     
       1. A component, comprising:
 an integrated circuit that includes one or more contacts; 
 a housing body encapsulating the integrated circuit; 
 a wiring device arrangement disposed below and fixed to the integrated circuit and the housing body; 
 a plurality of contact devices disposed below the wiring device arrangement for providing electrical contact between the wiring device arrangement and a carrier plate, wherein the wiring device arrangement is adapted to produce an electrical connection between the one or more contacts of the integrated circuit and the plurality of contact devices; and 
 a first and second group of contact devices of the plurality of contact devices that define an intermediate zone between the first and second group of contact devices that overlaps an edge of the integrated circuit, wherein a minimum distance between the first and second group of contact devices is greater than a distance between mutually adjacent contact devices of the first and second group of contact devices, respectively, and wherein the intermediate zone comprises contact devices that form contacts redundant to those in the first and second group of contact devices; 
 wherein the integrated circuit and housing body are positioned in a first plane and the wiring device arrangement extends in a second plane that is parallel to the first plane and is in direct contact with the integrated circuit. 
 
     
     
       2. The component of  claim 1 , wherein the housing body that includes an insulating layer, wherein a thickness of the wiring device arrangement is less than 50 micrometers. 
     
     
       3. The component of  claim 1 , wherein the first group of contact devices is arranged in series. 
     
     
       4. The component of  claim 1 , wherein:
 the first group of contact devices is positioned closer to an edge of the integrated circuit than the second group of contact devices; and 
 the first group of contact devices are arranged in accordance with a matrix in a multiplicity of columns and a multiplicity of rows. 
 
     
     
       5. The component of  claim 4 , wherein the intermediate zone overlaps the housing body. 
     
     
       6. The component of  claim 1 , wherein the component is electrically conductively connected to the carrier plate, the coefficient of thermal expansion of the housing body being within a range of +50 percent to −50 percent of the coefficient of thermal expansion of a carrier plate. 
     
     
       7. A component, comprising:
 an integrated circuit that includes one or more contacts; 
 a housing body encapsulating the integrated circuit; 
 a wiring device arrangement disposed below and fixed to the integrated circuit and the housing body; 
 a plurality of contact devices disposed below the wiring device arrangement for providing electrical contact between the wiring device arrangement and a carrier plate, wherein the wiring device arrangement is adapted to produce an electrical connection between the one or more contacts of the integrated circuit and the plurality of contact devices; and 
 a first and second group of contact devices of the plurality of contact devices that define an intermediate zone between the first and second group of contact devices that overlaps an edge of the integrated circuit, wherein a minimum distance between the first and second group of contact devices is greater than a distance between mutually adjacent contact devices of the first and second group of contact devices, respectively, and wherein the intermediate zone comprises contact devices that form contacts redundant to those in the first and second group of contact devices; 
 wherein the integrated circuit and housing body are positioned in a first plane and the wiring device arrangement extends in a second plane that is parallel to the first plane and is in direct contact with the integrated circuit, and 
 wherein the component is arranged on a carrier plate, and a difference between a coefficient of thermal expansion of the integrated circuit and a coefficient of thermal expansion of the carrier plate and a difference between a coefficient of thermal expansion of the housing body and a coefficient of thermal expansion of the carrier plate are equal. 
 
     
     
       8. The component of  claim 1 , wherein the wiring device arrangement is produced using thin film technology and is free of printed circuit board or ceramic material. 
     
     
       9. The component of  claim 1 , wherein the component comprises a dimension of greater than 9 millimeters, the plurality of contact devices comprising a diameter of 450 micrometers to 550 micrometers, and grid pitch is located between the one or more external contact devices comprising a range of 750 micrometers to 850 micrometers. 
     
     
       10. The component of  claim 1 , wherein the component comprises a dimension of greater than 7 millimeters, the plurality of contact devices comprising a diameter of 270 micrometers to 330 micrometers, and grid pitch is located between the one or more external contact devices that is greater than 400 micrometers. 
     
     
       11. The component of  claim 1 , wherein the component comprises a dimension of greater than 5 millimeters, the plurality of contact devices comprising a diameter of 220 micrometers to 280 micrometers, and grid pitch is located between the one or more external contact devices that is greater than 300 micrometers. 
     
     
       12. The component of  claim 1 , wherein the component comprises a dimension of greater than 4 millimeters, the plurality of contact devices comprising a diameter of 180 micrometers to 220 micrometers, and grid pitch is located between the one or more external contact devices that is greater than 250 micrometers. 
     
     
       13. A component, comprising:
 an integrated circuit that includes one or more contacts; 
 a housing body encapsulating the integrated circuit; 
 a wiring device arrangement disposed below and fixed to the integrated circuit and the housing body that includes an insulating layer 
 a plurality of contact devices disposed below the wiring device arrangement and arranged in accordance with a grid pitch in grid form for providing electrical contact between the wiring device arrangement and a carrier plate, and wherein the wiring device arrangement is adapted to produce an electrical connection between the one or more contacts of the integrated circuit and the plurality of contact devices; 
 one or more outer contact devices of the plurality of contact devices that are positioned closer to an edge of the component than one or more inner contact devices of the plurality of contact devices; and 
 an intermediate zone that is positioned between the one or more outer contact devices and the one or more inner contact devices and that overlaps an edge of the integrated circuit, the intermediate zone between one or more outer contact devices and one or more inner contact devices defining a distance that is greater than a distance between mutually adjacent outer contact devices or inner contact devices, and wherein the intermediate zone comprises contact devices that form contacts redundant to those in the first and second group of contact devices, 
 wherein the integrated circuit and the housing body are positioned in a first plane and the wiring device arrangement extends in a second plane that is parallel to the first plane and is in direct contact with the integrated circuit; and 
 wherein a maximum permitted creep strain in the contact devices is given, and contact device positions in the grid as defined by the grid pitch are not used when a creep strain at the contact device positions exceeds the maximum permitted creep strain. 
 
     
     
       14. The component of  claim 13 , wherein the component comprises a dimension of greater than 9 millimeters, the plurality of contact devices comprises a diameter of 450 micrometers to 550 micrometers, and grid pitch is located between the plurality of contact devices comprising a range of 750 micrometers to 850 micrometers. 
     
     
       15. The component of  claim 13 , wherein the component comprises a dimension of greater than 7 millimeters, the plurality of contact devices comprises a diameter of 270 micrometers to 330 micrometers, and grid pitch is located between the contact devices comprising a range of 450 micrometers to 550 micrometers. 
     
     
       16. The component of  claim 13 , wherein the component comprises a dimension of greater than 5 millimeters, the plurality of contact devices comprises a diameter of 220 micrometers to 280 micrometers, and grid pitch is located between the contact devices comprising a range of 350 micrometers to 450 micrometers.