Assignee
CHANG CHIEN-WEI
US·10 granted patents·15 pending applications·64 citations·filing 2004–2013
Top patents by PatentIndex Score
25 records- 0195US8173401B2Method for direct amplification from crude nucleic acid samplesCHANG CHIEN-WEI·Filed 2009·Granted May 8, 2012·43 cites·11 claims
- 0293US8460934B2Method for direct amplification from crude nucleic acid samplesCHANG CHIEN-WEI·Filed 2012·Granted Jun 11, 2013·13 cites·5 claims
- 0381US8153401B2Method for direct amplification from crude nucleic acid samplesCHANG CHIEN-WEI·Filed 2007·Granted Apr 10, 2012·2 cites·21 claims
- 0472US8083954B2Method for fabricating component-embedded printed circuit boardCHANG CHIEN-WEI·Filed 2008·Granted Dec 27, 2011·5 cites·8 claims
- 0560US8312624B1Method for manufacturing a heat dissipation structure of a printed circuit boardCHANG CHIEN-WEI·Filed 2011·Granted Nov 20, 2012·1 cites·4 claims
- 0655US2009111213A1High-Density Fine Line Structure And Method Of Manufacturing The SameCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 0754USRE45298EMultimedia playing deviceCHANG CHIEN-WEI·Filed 2013·Granted Dec 23, 2014·0 cites·15 claims
- 0854US8471375B2High-density fine line structure and method of manufacturing the sameCHANG CHIEN-WEI·Filed 2007·Granted Jun 25, 2013·0 cites·5 claims
- 0953US8305345B2Multimedia playing deviceCHANG CHIEN-WEI·Filed 2008·Granted Nov 6, 2012·0 cites·14 claims
- 1053US2009308527A1Method For Fabricating Circuit Trace On Core Board Having Buried HoleCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 1149US2008286958A1Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The SameCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 1249US2010075497A1Non-Plating Line Plating Method Using Current Transmitted From Ball SideCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 1349US2010075495A1Method Of Selectively Plating Without Plating LinesCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 1447US2010283145A1Stack structure with copper bumpsCHANG CHIEN-WEI·Filed 2009·Application pending·0 cites
- 1547US2011048777A1Component-Embedded Printed Circuit BoardCHANG CHIEN-WEI·Filed 2009·Application pending·0 cites
- 1646US2008185739A1Semiconductor Substrate Having Enhanced Adhesion And Method For Manufacturing The SameCHANG CHIEN-WEI·Filed 2007·Application pending·0 cites
- 1745US8186054B2Method of fabricating board having high density core layer and structure thereofCHANG CHIEN-WEI·Filed 2010·Granted May 29, 2012·0 cites·7 claims
- 1845US8161639B2Method for fabricating an interlayer conducting structure of an embedded circuitryCHANG CHIEN-WEI·Filed 2010·Granted Apr 24, 2012·0 cites·6 claims
- 1945US2011306505A1X-STR multiplex PCR amplification systemCHANG CHIEN-WEI·Filed 2011·Application pending·0 cites
- 2044US2009001547A1High-Density Fine Line Structure And Method Of Manufacturing The SameCHANG CHIEN-WEI·Filed 2007·Application pending·0 cites
- 2144US2008303150A1High-Density Fine Line Structure And Method Of Manufacturing The SameCHANG CHIEN-WEI·Filed 2007·Application pending·0 cites
- 2244US2009008766A1High-Density Fine Line Structure And Method Of Manufacturing The SameCHANG CHIEN-WEI·Filed 2007·Application pending·0 cites
- 2343US2010309608A1Buried Capacitor StructureCHANG CHIEN-WEI·Filed 2009·Application pending·0 cites
- 2438US2006030069A1Packaging method for manufacturing substratesCHANG CHIEN-WEI·Filed 2004·Application pending·0 cites
- 2536US2012228011A1Semiconductor Load BoardCHANG CHIEN-WEI·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →