Assignee
CHEN JEN-YI
TW·2 granted patents·2 pending applications·11 citations·filing 2004–2015
Top patents by PatentIndex Score
4 records- 0180US8586486B2Method for forming semiconductor deviceCHEN JEN-YI·Filed 2011·Granted Nov 19, 2013·6 cites·12 claims
- 0278US8468665B2Methods for making capacitive microphoneCHEN JEN-YI·Filed 2011·Granted Jun 25, 2013·5 cites·16 claims
- 0343US2017064458A1Mems microphone package structure having a non-planar substrateCHEN JEN-YI·Filed 2015·Application pending·0 cites
- 0435US2006001114A1Apparatus and method of wafer level packageCHEN JEN-YI·Filed 2004·Application pending·0 cites
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