Mems microphone package structure having a non-planar substrate

Abstract

A MEMS microphone package structure having a non-planar substrate is provided. It includes a non-planar substrate, a lid and a transducer. The non-planar substrate includes a bearing base and a peripheral wall connecting to the bearing base. The lid is covered and connected to the non-planar substrate to form a cavity, and at least one solder pad is disposed on an outer surface of the lid or the non-planar substrate. The transducer is disposed in the cavity. A sound hole is provided to correspond to the transducer, and the sound hole is disposed at the non-planar substrate or the lid.

What is claimed is: 
     
         1 . A MEMS microphone package structure having a non-planar substrate, comprising:
 a non-planar substrate comprising a multiple layers of printed circuit boards laminated together, said non-planar substrate comprising at least one first metal layer, a bearing base and a peripheral wall being surrounded and upwardly extended from a periphery of a top surface of said bearing base;   a lid covered on said non-planar substrate and connected to said peripheral wall to define a cavity;   a sound hole formed at said non-planar substrate or said lid;   an acoustic wave transducer mounted in said cavity;   an application-specific integrated circuit electrically connected with said acoustic wave transducer; and   at least one solder pad mounted at an outer surface of said lid or said non-planar substrate.   
     
     
         2 . The MEMS microphone package structure as claimed in  claim 1 , wherein said at least one first metal layer extends from said peripheral wall of said non-planar substrate to a bottom of said non-planar substrate. 
     
     
         3 . The MEMS microphone package structure as claimed in  claim 1 , wherein said lid is formed of at least one insulation layer and at least one second metal layer by lamination; said at least one second metal layer is electrically connected to said at least one first metal layer. 
     
     
         4 . The MEMS microphone package structure as claimed in  claim 3 , wherein said lid is selected from the material group of metal substrate, fiberglass substrate and ceramic substrate. 
     
     
         5 . The MEMS microphone package structure as claimed in  claim 3 , wherein said lid comprises two insulation layers and one second metal layer laminated between said two insulation layers, and said two insulation layers are made of different insulation materials respectively. 
     
     
         6 . The MEMS microphone package structure as claimed in  claim 3 , wherein said at least one second metal layer is arranged at a surface of at least one said insulation layer. 
     
     
         7 . The MEMS microphone package structure as claimed in  claim 1 , wherein said at least one solder pad and said sound hole are respectively disposed at said lid and said non-planar substrate. 
     
     
         8 . The MEMS microphone package structure as claimed in  claim 7 , wherein said at least one solder pad is electrically connected to said application-specific integrated circuit through said first metal layer. 
     
     
         9 . The MEMS microphone package structure as claimed in  claim 7 , wherein said at least one solder pad and said sound hole are both disposed at said lid or said non-planar substrate. 
     
     
         10 . The MEMS microphone package structure as claimed in  claim 1 , wherein said lid further comprises at least one via hole electrically connected to said at least one solder pad and said at least one first metal layer. 
     
     
         11 . The MEMS microphone package structure as claimed in  claim 1 , wherein said at least one first metal layer comprises at least two first metal layers adapted to work as a signal transmission path and/or a grounded conductive path. 
     
     
         12 . The MEMS microphone package structure as claimed in  claim 11 , wherein said signal transmission path is electrically connected to said application-specific integrated circuit and said at least one solder pad; said grounded conductive path is electrically connected with said lid and said non-planar substrate. 
     
     
         13 . The MEMS microphone package structure as claimed in  claim 1 , wherein said peripheral wall of said non-planar substrate is connected with said lid by at least one metal bump. 
     
     
         14 . The MEMS microphone package structure as claimed in  claim 1 , wherein said acoustic wave transducer is directly mounted on said sound hole. 
     
     
         15 . The MEMS microphone package structure as claimed in  claim 1 , wherein said application-specific integrated circuit is embedded in a bottom of said non-planar substrate. 
     
     
         16 . The MEMS microphone package structure as claimed in  claim 14 , wherein said non-planar substrate further comprises a third metal layer disposed at an inner surface of said peripheral wall. 
     
     
         17 . The MEMS microphone package structure as claimed in  claim 16 , wherein said at least one first metal layer is embedded in said peripheral wall. 
     
     
         18 . The MEMS microphone package structure as claimed in  claim 17 , wherein said third metal layer is arranged in an annular configuration. 
     
     
         19 . The MEMS microphone package structure as claimed in  claim 17 , wherein said at least one first metal layer comprises at least one first metal layer working as a signal transmission path and at least one metal layer working as a grounded conductive path.