Assignee
CHEN KUAN-NENG
US·14 granted patents·3 pending applications·45 citations·filing 2006–2012
Top patents by PatentIndex Score
17 records- 0191US8617689B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectric and structures so formedCHEN KUAN-NENG·Filed 2012·Granted Dec 31, 2013·10 cites·9 claims
- 0284US8076177B2Scalable transfer-join bonding lock-and-key structuresCHEN KUAN-NENG·Filed 2010·Granted Dec 13, 2011·7 cites·20 claims
- 0383US8653641B2Integrated circuit deviceCHEN KUAN-NENG·Filed 2012·Granted Feb 18, 2014·7 cites·10 claims
- 0480US8241995B2Bonding of substrates including metal-dielectric patterns with metal raised above dielectricCHEN KUAN-NENG·Filed 2006·Granted Aug 14, 2012·7 cites·18 claims
- 0572US8951837B2Submicron connection layer and method for using the same to connect wafersCHEN KUAN-NENG·Filed 2012·Granted Feb 10, 2015·3 cites·17 claims
- 0671US8168542B2Methods of forming tubular objectsCHEN KUAN-NENG·Filed 2008·Granted May 1, 2012·2 cites·19 claims
- 0768US8603862B2Precise-aligned lock-and-key bonding structuresCHEN KUAN-NENG·Filed 2010·Granted Dec 10, 2013·2 cites·8 claims
- 0866US8546952B2Electrical test structure applying 3D-ICS bonding technology for stacking error measurementCHEN KUAN-NENG·Filed 2011·Granted Oct 1, 2013·2 cites·13 claims
- 0965US8525144B2Programmable via devicesCHEN KUAN-NENG·Filed 2009·Granted Sep 3, 2013·2 cites·15 claims
- 1064US8389967B2Programmable via devicesCHEN KUAN-NENG·Filed 2007·Granted Mar 5, 2013·2 cites·19 claims
- 1163US8243507B2Programmable via devices in back end of line levelCHEN KUAN-NENG·Filed 2011·Granted Aug 14, 2012·1 cites·12 claims
- 1247US8536613B2Heterostructure containing IC and LED and method for fabricating the sameCHEN KUAN-NENG·Filed 2011·Granted Sep 17, 2013·0 cites·10 claims
- 1346US2009111263A1Method of Forming Programmable Via DevicesCHEN KUAN-NENG·Filed 2007·Application pending·0 cites
- 1439US9931813B2Bonding structure and method of fabricating the sameCHEN KUAN NENG·Filed 2010·Granted Apr 3, 2018·0 cites·18 claims
- 1539US2012228713A1Three-dimensional complementary metal oxide semiconductor deviceCHEN KUAN-NENG·Filed 2011·Application pending·0 cites
- 1638US2012153437A1Esd protection structure for 3d icCHEN KUAN-NENG·Filed 2011·Application pending·0 cites
- 1733US8508041B2Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereofCHEN KUAN-NENG·Filed 2011·Granted Aug 13, 2013·0 cites·9 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →