Assignee
CHEN KUANG-HSIUNG
TW·5 granted patents·1 pending application·60 citations·filing 2007–2011
Technology mixH10W6
Top patents by PatentIndex Score
6 records- 0193US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0271US8330267B2Semiconductor packageCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 11, 2012·5 cites·20 claims
- 0365US8779581B2Heat dissipating semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Granted Jul 15, 2014·2 cites·12 claims
- 0445US8058725B2Package structure and package substrate thereofCHEN KUANG-HSIUNG·Filed 2007·Granted Nov 15, 2011·1 cites·16 claims
- 0544US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 0640US8592962B2Semiconductor device packages with protective layer and related methodsCHEN KUANG-HSIUNG·Filed 2011·Granted Nov 26, 2013·0 cites·17 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →