Assignee
CHEN MING-FA
TW·12 granted patents·2 pending applications·639 citations·filing 2008–2012
Top patents by PatentIndex Score
14 records- 0198US8803292B2Through-substrate vias and methods for forming the sameCHEN MING-FA·Filed 2012·Granted Aug 12, 2014·383 cites·8 claims
- 0297US8791549B2Wafer backside interconnect structure connected to TSVsCHEN MING-FA·Filed 2010·Granted Jul 29, 2014·29 cites·19 claims
- 0396US8158456B2Method of forming stacked diesCHEN MING-FA·Filed 2008·Granted Apr 17, 2012·127 cites·20 claims
- 0494US8624324B1Connecting through vias to devicesCHEN MING-FA·Filed 2012·Granted Jan 7, 2014·16 cites·20 claims
- 0594US8501587B2Stacked integrated chips and methods of fabrication thereofCHEN MING-FA·Filed 2009·Granted Aug 6, 2013·32 cites·20 claims
- 0693US8399354B2Through-silicon via with low-K dielectric linerCHEN MING-FA·Filed 2009·Granted Mar 19, 2013·18 cites·5 claims
- 0790US8518796B2Semiconductor die connection system and methodCHEN MING-FA·Filed 2012·Granted Aug 27, 2013·6 cites·20 claims
- 0886US8222139B2Chemical mechanical polishing (CMP) processing of through-silicon via (TSV) and contact plug simultaneouslyCHEN MING-FA·Filed 2010·Granted Jul 17, 2012·9 cites·10 claims
- 0985US8288872B2Through silicon via layoutCHEN MING-FA·Filed 2008·Granted Oct 16, 2012·8 cites·20 claims
- 1081US8643149B2Stress barrier structures for semiconductor chipsCHEN MING-FA·Filed 2010·Granted Feb 4, 2014·6 cites·18 claims
- 1175US8436448B2Through-silicon via with air gapCHEN MING-FA·Filed 2011·Granted May 7, 2013·3 cites·20 claims
- 1269US8546886B2Controlling the device performance by forming a stressed backside dielectric layerCHEN MING-FA·Filed 2011·Granted Oct 1, 2013·2 cites·20 claims
- 1346US2012258590A1Chemical mechanical polishing (cmp) processing of through-silicon via (tsv) and contact plug simultaneouslyCHEN MING-FA·Filed 2012·Application pending·0 cites
- 1438US2013169109A1Comb electrode structureCHEN MING-FA·Filed 2012·Application pending·0 cites
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