Assignee
CHEN YU-REN
TW·3 granted patents·3 pending applications·22 citations·filing 2008–2011
Top patents by PatentIndex Score
6 records- 0190US8916969B2Semiconductor devices, packaging methods and structuresCHEN YU-REN·Filed 2011·Granted Dec 23, 2014·14 cites·15 claims
- 0287US8431437B2Packaging method involving rearrangement of diceCHEN YU-REN·Filed 2011·Granted Apr 30, 2013·8 cites·16 claims
- 0351US2008290478A1Lead-frame array package structure and methodCHEN YU-REN·Filed 2008·Application pending·0 cites
- 0449US8426245B2Packaging method involving rearrangement of diceCHEN YU-REN·Filed 2011·Granted Apr 23, 2013·0 cites·14 claims
- 0546US2009309209A1Die Rearrangement Package Structure and the Forming Method ThereofCHEN YU-REN·Filed 2009·Application pending·0 cites
- 0637US2012241972A1Layout scheme for an input output cellCHEN YU-REN·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →