Lead-frame array package structure and method

Abstract

The present invention provides a lead-frame array package structure. The package structure includes a lead-frame, which composed of a plurality of shorter leads and a plurality of longer leads. The first surface and a second surface are composed of the shorter leads and the longer leads. The chip is fixedly connected to the first surface of the lead-frame. The metal pads are positioned on the one side of the active layer of the chip. The metal pads are electrically connected to the leads of the lead-frame via the metal leads. The chip, the metal leads, the first surface and the second surface of the lead-frame is encapsulated by encapsulated material to expose the portion of the metal of the leads. The conductive elements are electrically connected to exposed leads so as to an array arrangement is formed on the second surface of the lead-frame.

1 . A semiconductor package structure comprising:
 a lead-frame formed by a plurality of shorter leads and a plurality of longer leads, and the shorter leads and the longer leads are respectively and alternatively paralleled to form a first surface and a second surface, a geographic shape is formed at the end of each of the longer leads, the ends with the geographic shape are disposed at the same horizontal as the end of each of the shorter leads;   a chip fixedly connected to the first surface of the lead-frame by an adhesive layer and including an active layer, one side of the active layer having a plurality of metal pads disposed thereon;   a plurality metal wires used to electrically connect the metal pads on the chip and the leads of the lead-frames;   an encapsulant material used to cover the chip, the metal leads and the first surface and the second surface of the lead-frame, and expose a portion of the metal of the leads; and   a plurality of conductive elements electrically connected to the exposed metal of the leads to form a dual row deploy on the second surface of the lead-frame.   
     
     
         2 . The package structure of  claim 1 , wherein the material of the adhesive layer is B-stage. 
     
     
         3 . The package structure of  claim 1 , wherein the conductive elements are conductive bump. 
     
     
         4 . The package structure of  claim 1 , wherein the conductive elements are solder ball. 
     
     
         5 . The package structure of  claim 1 , wherein the geographic shape is L-shape. 
     
     
         6 . The package structure of  claim 1 , wherein the geographic shape is curved shape. 
     
     
         7 . A semiconductor package structure comprising:
 a lead-frame formed in accordance with a plurality of shorter leads and a plurality of longer leads, and the shorter leads and the longer leads are respectively and alternatively paralleled to form a first surface and a second surface, a geographic shape is formed at the end of each of the plurality of longer leads, the ends with the geographic shape are disposed at the same horizontal as the end of each of the shorter leads;   a chip fixedly connected to the first surface of the lead-frame by a adhesive layer and including an active layer, one side of the active layer having a plurality of metal pads disposed thereon;   a plurality metal leads used to electrically connect the metal pads on the chip and the leads on the lead-frame;   an encapsulant material used to cover the chip, the metal leads and the first surface and the second surface of the lead frame lead-frame, and expose a portion of the metal of the leads; and   a plurality of conductive elements electrically connected to the exposed metal of the leads and formed an array deploy on the second surface of the leads.   
     
     
         8 . The package structure of  claim 7 , wherein the conductive elements are solder ball. 
     
     
         9 . The package structure of  claim 7 , wherein the geographic shape is L-shape. 
     
     
         10 . The package structure of  claim 7 , wherein the geographic shape is curved shape. 
     
     
         11 . A semiconductor package structure comprising:
 a lead-frame formed in accordance with a plurality of first leads and a plurality of second leads, and the first leads and the second leads are used to form a first surface and a second surface, the first leads and the second leads have a plurality of longer leads and a plurality of shorter leads, the longer leads and the shorter leads are respectively and alternatively paralleled, a geographic shape is formed at the end of each of the longer leads, the ends with the geographic shape are disposed at the same horizontal as the end of each of the shorter leads;   a chip fixedly connected to the first surface of the lead-frame by a adhesive layer and including an active layer, two corresponding side of the active layer having a plurality of metal pads disposed thereon;   a plurality metal leads used to electrically connect the metal pads on the chip and the leads on the lead-frame;   an encapsulant material used to cover the chip, the metal leads and the first surface and the second surface of the lead-frame, and expose a portion of the metal of the leads; and   a plurality of conductive elements electrically connected to the exposed metal of the leads and formed a dual row deploy on the second surface of the leads.   
     
     
         12 . The package structure of  claim 11 , wherein the conductive elements are disposed on the second surface of the lead frame by the way of bi-parallel. 
     
     
         13 . The package structure of  claim 11 , wherein the conductive elements are disposed on the second surface of the lead frame by the way of array. 
     
     
         14 . A lead-frame package method comprising:
 forming a lead-frame in accordance with a plurality of shorter leads and a plurality of longer leads, and the shorter leads and the longer leads are respectively and alternatively paralleled to form a first surface and a second surface, a geographic shape is formed at the end of each of the longer leads, the end with the geographic shape is disposed at the same horizontal as the end of each of the shorter leads;   fixedly connecting a chip to the first surface of the lead-frame by a adhesive layer and the chip has an active layer, one side of the active layer having a plurality of metal pads disposed thereon;   executing a wire bonding process to electrically connect a plurality of metal leads to the metal pads on the chip and the plurality of leads on the lead-frame;   executing an encapsulated process to cover the chip, the metal leads and the first surface and the second surface of the lead-frame by an encapsulant material;   exposing a portion of the metal of the second leads of the lead-frame by removing the encapsulant material on each end of the leads in accordance with a removing process; and   forming a plurality of conductive elements on the exposed metal leads and the conductive elements are used to electrically connected to the exposed metal leads.   
     
     
         15 . The package structure of  claim 14 , wherein the longer leads are formed by a group of leads. 
     
     
         16 . A lead-frame package structure formed in accordance with a plurality of shorter leads and a plurality of longer leads, and the shorter leads and the longer leads are respectively and alternatively paralleled to each other, characterized by:
 a geographic shape formed at the end of each of the longer leads and the end with the geographic shape is disposed at the same horizontal as the end of each of the shorter leads.   
     
     
         17 . A lead-frame package structure formed in accordance with a plurality of shorter leads and a plurality of leads, which is longer leads than the short leads, and the shorter leads and the longer leads are respectively and alternatively paralleled to each other, characterized by:
 a geographic shape formed at the end of each of the longer leads and the end with the geographic shape is disposed at the same horizontal as the end of each of the shorter leads.   
     
     
         18 . A lead frame package structure formed in accordance with a plurality of first leads and a plurality of second leads, the first leads includes a plurality of shorter leads and a plurality of longer leads, the second leads includes a plurality of shorter leads and a plurality of longer leads, and the first leads and the second leads are respectively and alternatively paralleled to each other, characterized by:
 a geographic shape formed at the end of each of the longer leads and the end with the geographic shape is disposed at the same horizontal as the end of each of the short lead.