Assignee
CHENG HUNG-HSIANG
TW·2 granted patents·3 pending applications·11 citations·filing 2009–2011
Top patents by PatentIndex Score
5 records- 0182US8541883B2Semiconductor device having shielded conductive viasCHENG HUNG-HSIANG·Filed 2011·Granted Sep 24, 2013·8 cites·14 claims
- 0262US8193454B2Circuit substrate having power/ground plane with grid holesCHENG HUNG-HSIANG·Filed 2009·Granted Jun 5, 2012·3 cites·10 claims
- 0344US2010065312A1Substrate for window ball grid array packageCHENG HUNG-HSIANG·Filed 2009·Application pending·0 cites
- 0443US2010071939A1Substrate of window ball grid array packageCHENG HUNG-HSIANG·Filed 2009·Application pending·0 cites
- 0533US2010283139A1Semiconductor Device Package Having Chip With Conductive LayerCHENG HUNG-HSIANG·Filed 2010·Application pending·0 cites
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