Assignee
CHENG MING-DA
TW·7 granted patents·2 pending applications·43 citations·filing 2008–2012
Top patents by PatentIndex Score
9 records- 0195US8659155B2Mechanisms for forming copper pillar bumpsCHENG MING-DA·Filed 2010·Granted Feb 25, 2014·33 cites·25 claims
- 0279US9786622B2Semiconductor packageCHENG MING-DA·Filed 2011·Granted Oct 10, 2017·5 cites·20 claims
- 0375US8227334B2Doping minor elements into metal bumpsCHENG MING-DA·Filed 2010·Granted Jul 24, 2012·3 cites·18 claims
- 0474US9538582B2Warpage control in the packaging of integrated circuitsCHENG MING-DA·Filed 2012·Granted Jan 3, 2017·2 cites·20 claims
- 0552US8067292B2Isolation structure, non-volatile memory having the same, and method of fabricating the sameCHENG MING-DA·Filed 2008·Granted Nov 29, 2011·0 cites·22 claims
- 0648US2012286423A1Doping Minor Elements into Metal BumpsCHENG MING-DA·Filed 2012·Application pending·0 cites
- 0747US8653592B2Isolation structure, non-volatile memory having the same, and method of fabricating the sameCHENG MING-DA·Filed 2011·Granted Feb 18, 2014·0 cites·24 claims
- 0844US8501615B2Metal bump formationCHENG MING-DA·Filed 2011·Granted Aug 6, 2013·0 cites·19 claims
- 0940US2013099371A1Semiconductor package having solder jointed region with controlled ag contentCHENG MING-DA·Filed 2011·Application pending·0 cites
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