Assignee
CHIU TZU WEI
TW·5 granted patents·1 pending application·9 citations·filing 2010–2024
Top patents by PatentIndex Score
6 records- 0178US8587089B2Seal ring structure with polyimide layer adhesionCHIU TZU-WEI·Filed 2010·Granted Nov 19, 2013·6 cites·20 claims
- 0275US2025132229A1Method for manufacturing semiconductor structure with power connecting structures under transistorsCHIU TZU WEI·Filed 2024·Application pending·0 cites
- 0367US12224227B2Method for manufacturing semiconductor structure with power connecting structures under transistors and semiconductor structure with power connecting structures under transistorsCHIU TZU WEI·Filed 2022·Granted Feb 11, 2025·0 cites·2 claims
- 0464US8896089B2Interposers for semiconductor devices and methods of manufacture thereofCHIU TZU-WEI·Filed 2011·Granted Nov 25, 2014·2 cites·20 claims
- 0561US9553053B2Bump structure for yield improvementCHIU TZU-WEI·Filed 2012·Granted Jan 24, 2017·1 cites·21 claims
- 0651US12568856B2Method of manufacturing three-dimensional system-on-chip and three-dimensional system-on-chipCHIU TZU WEI·Filed 2022·Granted Mar 3, 2026·0 cites·9 claims
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