Assignee
CHO NAMJU
KR·10 granted patents·1 pending application·247 citations·filing 2009–2011
Top patents by PatentIndex Score
11 records- 0198US8264091B2Integrated circuit packaging system with encapsulated via and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Sep 11, 2012·95 cites·20 claims
- 0297US9496152B2Carrier system with multi-tier conductive posts and method of manufacture thereofCHO NAMJU·Filed 2010·Granted Nov 15, 2016·42 cites·20 claims
- 0397US8318539B2Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnectsCHO NAMJU·Filed 2011·Granted Nov 27, 2012·37 cites·10 claims
- 0496US8390108B2Integrated circuit packaging system with stacking interconnect and method of manufacture thereofCHO NAMJU·Filed 2009·Granted Mar 5, 2013·47 cites·19 claims
- 0586US8476111B2Integrated circuit packaging system with intra substrate die and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Jul 2, 2013·8 cites·10 claims
- 0681US8541872B2Integrated circuit package system with package stacking and method of manufacture thereofCHO NAMJU·Filed 2010·Granted Sep 24, 2013·6 cites·20 claims
- 0780US8564125B2Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Oct 22, 2013·5 cites·18 claims
- 0877US8389329B2Integrated circuit packaging system with package stacking and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Mar 5, 2013·4 cites·20 claims
- 0971US9355939B2Integrated circuit package stacking system with shielding and method of manufacture thereofCHO NAMJU·Filed 2010·Granted May 31, 2016·3 cites·20 claims
- 1048US2010244223A1Integrated circuit packaging system with an integral-interposer-structure and method of manufacture thereofCHO NAMJU·Filed 2009·Application pending·0 cites
- 1142US9054098B2Integrated circuit packaging system with redistribution layer and method of manufacture thereofCHO NAMJU·Filed 2011·Granted Jun 9, 2015·0 cites·20 claims
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →