Assignee
COLLINS DAVID S
US·6 granted patents·2 pending applications·44 citations·filing 2006–2011
Top patents by PatentIndex Score
8 records- 0195US8674423B2Semiconductor structure having vias and high density capacitorsCOLLINS DAVID S·Filed 2011·Granted Mar 18, 2014·26 cites·18 claims
- 0283US8288244B2Lateral passive device having dual annular electrodesCOLLINS DAVID S·Filed 2010·Granted Oct 16, 2012·6 cites·4 claims
- 0379US8101494B2Structure, design structure and method of manufacturing a structure having VIAS and high density capacitorsCOLLINS DAVID S·Filed 2008·Granted Jan 24, 2012·7 cites·24 claims
- 0468US8234606B2Metal wiring structure for integration with through substrate viasCOLLINS DAVID S·Filed 2011·Granted Jul 31, 2012·2 cites·20 claims
- 0564US8138607B2Metal fill structures for reducing parasitic capacitanceCOLLINS DAVID S·Filed 2009·Granted Mar 20, 2012·3 cites·20 claims
- 0648US2008142861A1Symmetric capacitor structureCOLLINS DAVID S·Filed 2008·Application pending·0 cites
- 0743US8125013B2Structure, design structure and method of manufacturing a structure having VIAS and high density capacitorsCOLLINS DAVID S·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 0839US2007205430A1Method and structure of refractory metal reach through in bipolar transistorCOLLINS DAVID S·Filed 2006·Application pending·0 cites
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