Assignee
DISCO CORP
JP·1,494 granted patents·626 pending applications·5,881 citations·filing 1997–2025
Top patents by PatentIndex Score
2,120 records- 0199US12288682B2Processing method of waferDISCO CORP·Filed 2022·Granted Apr 29, 2025·8 cites·15 claims
- 0299US11958132B2SiC ingot processing method and laser processing apparatusDISCO CORP·Filed 2020·Granted Apr 16, 2024·10 cites·3 claims
- 0399US11819950B2Edge position detecting apparatusDISCO CORP·Filed 2021·Granted Nov 21, 2023·11 cites·14 claims
- 0499US11590630B2Workpiece grinding methodDISCO CORP·Filed 2021·Granted Feb 28, 2023·4 cites·2 claims
- 0599US9878397B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Jan 30, 2018·50 cites·3 claims
- 0699US9868177B2Wafer producing methodDISCO CORP·Filed 2017·Granted Jan 16, 2018·36 cites·1 claims
- 0799US9815138B2Wafer producing methodDISCO CORP·Filed 2016·Granted Nov 14, 2017·26 cites·4 claims
- 0898US12151401B2Edge alignment methodDISCO CORP·Filed 2021·Granted Nov 26, 2024·10 cites·3 claims
- 0998US11858090B2Grinding apparatus and method of driving grinding apparatusDISCO CORP·Filed 2021·Granted Jan 2, 2024·2 cites·12 claims
- 1098US10406635B2Wafer producing method and processing feed direction detecting methodDISCO CORP·Filed 2017·Granted Sep 10, 2019·13 cites·2 claims
- 1198US9789565B2Wafer producing methodDISCO CORP·Filed 2015·Granted Oct 17, 2017·28 cites·2 claims
- 1298US9620415B2Wafer processing methodDISCO CORP·Filed 2016·Granted Apr 11, 2017·49 cites·4 claims
- 1398US9481051B2Wafer producing methodDISCO CORP·Filed 2016·Granted Nov 1, 2016·48 cites·3 claims
- 1498US7507639B2Wafer dividing methodDISCO CORP·Filed 2006·Granted Mar 24, 2009·117 cites·2 claims
- 1598US7435607B2Method of wafer laser processing using a gas permeable protective tapeDISCO CORP·Filed 2005·Granted Oct 14, 2008·113 cites·3 claims
- 1697US12109667B2Spindle unit and processing apparatusDISCO CORP·Filed 2021·Granted Oct 8, 2024·2 cites·12 claims
- 1797US11538704B2Processing method of workpieceDISCO CORP·Filed 2020·Granted Dec 27, 2022·6 cites·9 claims
- 1897US11276588B2Method of processing waferDISCO CORP·Filed 2020·Granted Mar 15, 2022·4 cites·5 claims
- 1997US11222822B2Workpiece cutting methodDISCO CORP·Filed 2020·Granted Jan 11, 2022·10 cites·16 claims
- 2097US10155323B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Dec 18, 2018·22 cites·6 claims
- 2197US9517530B2Wafer producing methodDISCO CORP·Filed 2016·Granted Dec 13, 2016·31 cites·1 claims
- 2297US7473866B2Laser processing apparatusDISCO CORP·Filed 2006·Granted Jan 6, 2009·124 cites·3 claims
- 2397US7468309B2Semiconductor wafer treatment methodDISCO CORP·Filed 2006·Granted Dec 23, 2008·114 cites·4 claims
- 2497US7402773B2Laser beam processing machineDISCO CORP·Filed 2006·Granted Jul 22, 2008·33 cites·5 claims
- 2597US6998571B2Laser beam processing machineDISCO CORP·Filed 2004·Granted Feb 14, 2006·137 cites·5 claims
- 2697US6528864B1Semiconductor wafer having regular or irregular chip pattern and dicing method for the sameDISCO CORP·Filed 2000·Granted Mar 4, 2003·180 cites·3 claims
- 2797US6465158B1Semiconductor wafer dividing methodDISCO CORP·Filed 2000·Granted Oct 15, 2002·149 cites·5 claims
- 2897US6344402B1Method of dicing workpieceDISCO CORP·Filed 2000·Granted Feb 5, 2002·149 cites·3 claims
- 2996US12191138B2Processing method of workpieceDISCO CORP·Filed 2021·Granted Jan 7, 2025·8 cites·10 claims
- 3096US11201126B2Method of producing a substrate and system for producing a substrateDISCO CORP·Filed 2020·Granted Dec 14, 2021·4 cites·12 claims
- 3196US10870176B2SiC wafer producing methodDISCO CORP·Filed 2017·Granted Dec 22, 2020·16 cites·2 claims
- 3296US9925619B2Wafer producing methodDISCO CORP·Filed 2016·Granted Mar 27, 2018·23 cites·3 claims
- 3396US9808884B2Polycrystalline SiC wafer producing methodDISCO CORP·Filed 2016·Granted Nov 7, 2017·16 cites·4 claims
- 3496US7364986B2Laser beam processing method and laser beam machineDISCO CORP·Filed 2004·Granted Apr 29, 2008·121 cites·5 claims
- 3596US7179723B2Wafer processing methodDISCO CORP·Filed 2004·Granted Feb 20, 2007·138 cites·7 claims
- 3696US6803247B2Method for dividing semiconductor waferDISCO CORP·Filed 2003·Granted Oct 12, 2004·135 cites·5 claims
- 3795US11717927B2Workpiece grinding methodDISCO CORP·Filed 2022·Granted Aug 8, 2023·2 cites·2 claims
- 3895US11651988B2Processing apparatusDISCO CORP·Filed 2022·Granted May 16, 2023·3 cites·3 claims
- 3995US10357851B2Wafer producing methodDISCO CORP·Filed 2017·Granted Jul 23, 2019·15 cites·2 claims
- 4095US9764420B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·14 cites·2 claims
- 4195US9764428B2Wafer producing methodDISCO CORP·Filed 2015·Granted Sep 19, 2017·15 cites·2 claims
- 4295US9349647B2Cutting methodDISCO CORP·Filed 2015·Granted May 24, 2016·12 cites·3 claims
- 4395US7462094B2Wafer grinding methodDISCO CORP·Filed 2007·Granted Dec 9, 2008·25 cites·2 claims
- 4495US7265033B2Laser beam processing method for a semiconductor waferDISCO CORP·Filed 2004·Granted Sep 4, 2007·138 cites·2 claims
- 4594US12094742B2Processing apparatusDISCO CORP·Filed 2021·Granted Sep 17, 2024·3 cites·10 claims
- 4694US11980993B2Method of grinding workpieceDISCO CORP·Filed 2022·Granted May 14, 2024·2 cites·12 claims
- 4794US11935778B2Holding mechanism including Bernoulli padDISCO CORP·Filed 2021·Granted Mar 19, 2024·3 cites·3 claims
- 4894US10964571B2Conveyance systemDISCO CORP·Filed 2020·Granted Mar 30, 2021·3 cites·4 claims
- 4994US10668595B2Method of using laminated dressing boardDISCO CORP·Filed 2018·Granted Jun 2, 2020·5 cites·8 claims
- 5094US10201907B2SiC wafer producting methodDISCO CORP·Filed 2017·Granted Feb 12, 2019·12 cites·6 claims
Showing the top 50 of 2,120 patent records by PatentIndex Score.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →