Assignee
DYCONEX AG
CH·10 granted patents·4 pending applications·54 citations·filing 1992–2023
Top patents by PatentIndex Score
14 records- 0176US5382505AMethod of making a laminated structure with shear force delamination resistanceDYCONEX AG·Filed 1992·Granted Jan 17, 1995·41 cites·10 claims
- 0268US12343539B2Implant comprising embedded conductor track and production methodDYCONEX AG·Filed 2022·Granted Jul 1, 2025·0 cites·14 claims
- 0361US6954986B2Method for fabricating electrical connecting elementDYCONEX AG·Filed 2001·Granted Oct 18, 2005·10 cites·6 claims
- 0456US2015345043A1Method for Electrodeposition of an Electrode on a Dielectric SubstrateDYCONEX AG·Filed 2015·Application pending·0 cites
- 0553US11940481B2Electrical connection test for unpopulated printed circuit boardsDYCONEX AG·Filed 2020·Granted Mar 26, 2024·0 cites·14 claims
- 0653US2026013768A1Multi-electrode array deviceDYCONEX AG·Filed 2023·Application pending·0 cites
- 0749US11541244B2Detachable seal for medical implantsDYCONEX AG·Filed 2020·Granted Jan 3, 2023·0 cites·15 claims
- 0849US11504506B2Strain sensor for a medical devices with improved measurement sensitivityDYCONEX AG·Filed 2019·Granted Nov 22, 2022·0 cites·17 claims
- 0949US7691276B2Method for manufacturing an electrical connecting element, and a connecting elementDYCONEX AG·Filed 2006·Granted Apr 6, 2010·3 cites·9 claims
- 1047US11456277B2Thermocompression bonding of electronic componentsDYCONEX AG·Filed 2020·Granted Sep 27, 2022·0 cites·19 claims
- 1146US7892625B2Method of fabricating an electrical connecting element, and an electrical connecting elementDYCONEX AG·Filed 2006·Granted Feb 22, 2011·0 cites·8 claims
- 1244US10932386B2Electronic module and method for producing sameDYCONEX AG·Filed 2018·Granted Feb 23, 2021·0 cites·14 claims
- 1332US2019246931A1Implantable multielectrode array, method for producing an implantable multielectrode array and device for performing the methodDYCONEX AG·Filed 2019·Application pending·0 cites
- 1430US2018076155A1Extremely High Frequency Electronic ComponentDYCONEX AG·Filed 2017·Application pending·0 cites
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