Method for Electrodeposition of an Electrode on a Dielectric Substrate

Abstract

A method for the electrodeposition of an electrode including a metallic electrode material ( 40 ) on a dielectric substrate ( 10 ), including the following steps: depositing an electrically conductive polymer layer ( 20 ); masking the electrically conductive polymer layer ( 20 ) using a mask; electrodepositing the metallic electrode material ( 40 ) on the electrically conductive polymer layer ( 20 ); removing the mask; and removing or deactivating the excess conductive polymer layer ( 20 ).

1 - 2 . (canceled) 
     
     
         3 . A method for the electrodeposition of an electrode including a metallic electrode material on a dielectric substrate, comprising the following steps:
 applying a conductive layer onto the substrate;   patterning the conductive layer to create exposed regions on the substrate;   depositing an electrically conductive polymer layer at least in the exposed regions;   masking the conductive layer and the electrically conductive polymer layer in the exposed regions and/or masking the remaining metal layer using a mask;   electrodepositing the metallic electrode material on the electrically conductive polymer layer;   removing the mask; and   removing or deactivating the excess conductive polymer layer.   
     
     
         4 . The method according to  claim 3 , wherein, during electrodeposition through a portion of the mask, the conductive layer is separated from the region provided for deposition of the metallic electrode material, wherein the conductive layer tightly encloses the region. 
     
     
         5 . The method according to  claim 3 , wherein current can flow primarily across the conductive layer during electrodeposition. 
     
     
         6 . The method according to  claim 3 , wherein the conductive layer is coated with a diffusion barrier layer before the electrodeposition of the metallic electrode material. 
     
     
         7 . The method according to  claim 3 , wherein the conductive layer is removed at least in regions. 
     
     
         8 - 11 . (canceled) 
     
     
         12 . A method for the electrodeposition of an electrode including a metallic electrode material on a dielectric substrate, comprising the following steps:
 depositing a metallic conductive layer on the substrate;   patterning the metallic conductive layer so that at least one region of the substrate remains exposed;   depositing a diffusion barrier layer on the metallic conductive layer;   depositing an electrically conductive polymer layer in the at least one exposed region;   masking the metallic conductive layer and the electrically conductive polymer layer in the at least one exposed region using a mask;   electrodepositing the metallic electrode material on exposed regions of the electrically conductive polymer layer and the metallic conductive layer;   removing the mask; and   removing the excess conductive polymer layer or deactivating the excess conductive polymer layer by reducing the electrical conductivity of the electrically conductive polymer layer outside of the deposited metallic electrode material.   
     
     
         13 . The method according to  claim 12 , wherein current can flow primarily across the electrically conductive polymer layer during electrodeposition. 
     
     
         14 . The method according to  claim 12 , wherein a photoresist mask is used to mask the electrically conductive polymer layer. 
     
     
         15 . The method according to  claim 12 , wherein the electrically conductive polymer layer is removed outside of the deposited metallic electrode material. 
     
     
         16 . The method according to  claim 12 , wherein the electrically conductive polymer layer is at most 10 micrometers thick. 
     
     
         17 . The method according to  claim 12 , wherein a noble metal or an alloy of noble metals is used as the metallic electrode material. 
     
     
         18 . The method according to  claim 12 , further comprising selectively etching the metallic conductive layer and the diffusion barrier layer.