Inventor · disambiguated record
Marc Hauer
Also filed as: HAUER MARC · HAUER MARC ROBERT
17 granted patents·6 pending applications·15 citations·filing 2006–2023
88Inventor score
Files withDYCONEX AG8BIOTRONIK SE & CO KG7HAUER MARC6DOERR THOMAS1LITRONIK BATTERIETECHNOLOGIE GMBH1
Top patents by PatentIndex Score
23 records- 0174US11446503B2Implant comprising embedded conductor track and production methodBIOTRONIK SE & CO KG·Filed 2019·Granted Sep 20, 2022·2 cites·14 claims
- 0273US9357968B2Self-cleaning sensor surfaces for implantable sensor systemsHAUER MARC·Filed 2011·Granted Jun 7, 2016·7 cites·15 claims
- 0368US12343539B2Implant comprising embedded conductor track and production methodDYCONEX AG·Filed 2022·Granted Jul 1, 2025·0 cites·14 claims
- 0464US10964459B2Electrical resistor, in particular for medical implantsBIOTRONIK SE & CO KG·Filed 2019·Granted Mar 30, 2021·1 cites·15 claims
- 0564US8677615B2Method for embedding electrical componentsHAUER MARC·Filed 2011·Granted Mar 25, 2014·2 cites·19 claims
- 0663US11610703B2Diffusion barrier for implantable electrode leadsBIOTRONIK SE & CO KG·Filed 2019·Granted Mar 21, 2023·0 cites·15 claims
- 0761US2025316808A1Battery comprising insulated connecting stripLITRONIK BATTERIETECHNOLOGIE GMBH·Filed 2023·Application pending·0 cites
- 0859US10068681B2Method for producing an electrode lead or a catheter, and associated semifinished productBIOTRONIK SE & CO KG·Filed 2017·Granted Sep 4, 2018·2 cites·15 claims
- 0956US2015345043A1Method for Electrodeposition of an Electrode on a Dielectric SubstrateDYCONEX AG·Filed 2015·Application pending·0 cites
- 1054US8509898B2Electronic device or electric componentHAUER MARC·Filed 2011·Granted Aug 13, 2013·1 cites·20 claims
- 1153US10154617B2Integral metallic joint based on electrodepositionBIOTRONIK SE & CO KG·Filed 2017·Granted Dec 11, 2018·0 cites·13 claims
- 1249US11541244B2Detachable seal for medical implantsDYCONEX AG·Filed 2020·Granted Jan 3, 2023·0 cites·15 claims
- 1349US11504506B2Strain sensor for a medical devices with improved measurement sensitivityDYCONEX AG·Filed 2019·Granted Nov 22, 2022·0 cites·17 claims
- 1447US11456277B2Thermocompression bonding of electronic componentsDYCONEX AG·Filed 2020·Granted Sep 27, 2022·0 cites·19 claims
- 1546US7892625B2Method of fabricating an electrical connecting element, and an electrical connecting elementDYCONEX AG·Filed 2006·Granted Feb 22, 2011·0 cites·8 claims
- 1644US10932386B2Electronic module and method for producing sameDYCONEX AG·Filed 2018·Granted Feb 23, 2021·0 cites·14 claims
- 1744US8679010B2Implantable sensor deviceDOERR THOMAS·Filed 2011·Granted Mar 25, 2014·0 cites·8 claims
- 1842US2012118752A1Method for Electrodeposition of an Electrode on a Dielectric SubstrateHAUER MARC·Filed 2011·Application pending·0 cites
- 1940US9095703B2Self-dissolving electrode or probe implantHAUER MARC·Filed 2011·Granted Aug 4, 2015·0 cites·18 claims
- 2039US10426948B2Extendable electrodeBIOTRONIK SE & CO KG·Filed 2016·Granted Oct 1, 2019·0 cites·9 claims
- 2136US2018068759A1Stretchable Electrode Conductor Arrangement and Medical ImplantBIOTRONIK SE & CO KG·Filed 2017·Application pending·0 cites
- 2236US2012085750A1Covering Device for an Organic Substrate, Substrate with a Covering Device, and Method for Producing a Covering DeviceHAUER MARC·Filed 2011·Application pending·0 cites
- 2330US2018076155A1Extremely High Frequency Electronic ComponentDYCONEX AG·Filed 2017·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Marc Hauer files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →