Method for Electrodeposition of an Electrode on a Dielectric Substrate

Abstract

A method for the electrodeposition of an electrode including a metallic electrode material ( 40 ) on a dielectric substrate ( 10 ), including the following steps: depositing an electrically conductive polymer layer ( 20 ); masking the electrically conductive polymer layer ( 20 ) using a mask; electrodepositing the metallic electrode material ( 40 ) on the electrically conductive polymer layer ( 20 ); removing the mask; and removing or deactivating the excess conductive polymer layer ( 20 ).

1 . A method for the electrodeposition of an electrode including a metallic electrode material on a dielectric substrate, comprising the following steps:
 depositing an electrically conductive polymer layer on the substrate;   masking the electrically conductive polymer layer using a mask;   electrodepositing the metallic electrode material on the electrically conductive polymer layer;   removing the mask; and   removing or deactivating the excess conductive polymer layer.   
     
     
         2 . The method according to  claim 1 , wherein current can flow primarily across the electrically conductive polymer layer during electrodeposition. 
     
     
         3 . A method for the electrodeposition of an electrode including a metallic electrode material on a dielectric substrate, comprising the following steps:
 applying a conductive layer onto the substrate;   patterning the conductive layer to create exposed regions on the substrate;   depositing an electrically conductive polymer layer at least in the exposed regions;   masking the conductive layer and the electrically conductive polymer layer in the exposed regions and/or masking the remaining metal layer using a mask;   electrodepositing the metallic electrode material on the electrically conductive polymer layer;   removing the mask; and   removing or deactivating the excess conductive polymer layer.   
     
     
         4 . The method according to  claim 3 , wherein, during electrodeposition through a portion of the mask, the conductive layer is separated from the region provided for deposition of the metallic electrode material, wherein the conductive layer tightly encloses the region. 
     
     
         5 . The method according to  claim 3 , wherein current can flow primarily across the conductive layer during electrodeposition. 
     
     
         6 . The method according to  claim 3 , wherein the conductive layer is coated with a diffusion barrier layer before the electrodeposition of the metallic electrode material. 
     
     
         7 . The method according to  claim 3 , wherein the conductive layer is removed at least in regions. 
     
     
         8 . The method according to  claim 1 , wherein a photoresist mask is used to mask the electrically conductive polymer layer. 
     
     
         9 . The method according to  claim 1 , wherein the electrically conductive polymer layer is removed outside of the deposited metallic electrode material. 
     
     
         10 . The method according to  claim 1 , wherein an electrical conductivity of the electrically conductive polymer layer is reduced outside of the deposited metallic electrode material. 
     
     
         11 . The method according to  claim 1 , wherein a noble metal or an alloy of noble metals is used as the metallic electrode material.